JPS5317623B2 - - Google Patents
Info
- Publication number
- JPS5317623B2 JPS5317623B2 JP12954972A JP12954972A JPS5317623B2 JP S5317623 B2 JPS5317623 B2 JP S5317623B2 JP 12954972 A JP12954972 A JP 12954972A JP 12954972 A JP12954972 A JP 12954972A JP S5317623 B2 JPS5317623 B2 JP S5317623B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12954972A JPS5317623B2 (en) | 1972-12-26 | 1972-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12954972A JPS5317623B2 (en) | 1972-12-26 | 1972-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4997062A JPS4997062A (en) | 1974-09-13 |
| JPS5317623B2 true JPS5317623B2 (en) | 1978-06-09 |
Family
ID=15012247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12954972A Expired JPS5317623B2 (en) | 1972-12-26 | 1972-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5317623B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3028496C2 (en) * | 1980-07-26 | 1986-04-24 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Adhesion promoter for a carrier material |
| JPS60133054A (en) * | 1983-12-05 | 1985-07-16 | Nippon Kokuen Kogyo Kk | Composition for conductively anisotropic heat sealing, its manufacture and its usage |
| JPH0629397B2 (en) * | 1985-05-21 | 1994-04-20 | 東芝ケミカル株式会社 | Adhesive composition for flexible printed wiring board |
| JP5233135B2 (en) * | 2007-03-13 | 2013-07-10 | 住友ベークライト株式会社 | LAMINATED PLATE, METHOD FOR PRODUCING LAMINATED PLATE, AND SEMICONDUCTOR DEVICE |
| JP6269034B2 (en) * | 2013-12-20 | 2018-01-31 | Dic株式会社 | Double-sided adhesive tape |
-
1972
- 1972-12-26 JP JP12954972A patent/JPS5317623B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4997062A (en) | 1974-09-13 |