JPS5316671B1 - - Google Patents

Info

Publication number
JPS5316671B1
JPS5316671B1 JP9352971A JP9352971A JPS5316671B1 JP S5316671 B1 JPS5316671 B1 JP S5316671B1 JP 9352971 A JP9352971 A JP 9352971A JP 9352971 A JP9352971 A JP 9352971A JP S5316671 B1 JPS5316671 B1 JP S5316671B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9352971A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5316671B1 publication Critical patent/JPS5316671B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/59Bond pads specially adapted therefor

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP9352971A 1970-11-20 1971-11-20 Pending JPS5316671B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2057204A DE2057204C3 (de) 1970-11-20 1970-11-20 Verfahren zur Herstellung von Metall-Halbleiterkontakten

Publications (1)

Publication Number Publication Date
JPS5316671B1 true JPS5316671B1 (enExample) 1978-06-02

Family

ID=5788703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9352971A Pending JPS5316671B1 (enExample) 1970-11-20 1971-11-20

Country Status (10)

Country Link
US (1) US3819432A (enExample)
JP (1) JPS5316671B1 (enExample)
BE (1) BE775571A (enExample)
CA (1) CA920723A (enExample)
DE (1) DE2057204C3 (enExample)
FR (1) FR2115205B1 (enExample)
GB (1) GB1346950A (enExample)
IT (1) IT940614B (enExample)
LU (1) LU64296A1 (enExample)
NL (1) NL7115929A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2360993A1 (fr) * 1976-08-03 1978-03-03 Lignes Telegraph Telephon Perfectionnement aux procedes de fabrication de diodes schottky a barriere or-silicium
US4215156A (en) * 1977-08-26 1980-07-29 International Business Machines Corporation Method for fabricating tantalum semiconductor contacts
US5254869A (en) * 1991-06-28 1993-10-19 Linear Technology Corporation Aluminum alloy/silicon chromium sandwich schottky diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3094489A (en) * 1959-08-31 1963-06-18 Monsanto Chemicals Method and composition for brightening aluminum
US3423205A (en) * 1964-10-30 1969-01-21 Bunker Ramo Method of making thin-film circuits
US3368124A (en) * 1965-12-09 1968-02-06 Rca Corp Semiconductor devices
US3597667A (en) * 1966-03-01 1971-08-03 Gen Electric Silicon oxide-silicon nitride coatings for semiconductor devices

Also Published As

Publication number Publication date
US3819432A (en) 1974-06-25
LU64296A1 (enExample) 1972-06-02
DE2057204A1 (de) 1972-06-08
FR2115205B1 (enExample) 1977-04-22
DE2057204B2 (de) 1974-07-11
NL7115929A (enExample) 1972-05-24
CA920723A (en) 1973-02-06
IT940614B (it) 1973-02-20
GB1346950A (en) 1974-02-13
FR2115205A1 (enExample) 1972-07-07
BE775571A (fr) 1972-03-16
DE2057204C3 (de) 1975-02-27

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