JPS5316278Y2 - - Google Patents
Info
- Publication number
- JPS5316278Y2 JPS5316278Y2 JP1972099164U JP9916472U JPS5316278Y2 JP S5316278 Y2 JPS5316278 Y2 JP S5316278Y2 JP 1972099164 U JP1972099164 U JP 1972099164U JP 9916472 U JP9916472 U JP 9916472U JP S5316278 Y2 JPS5316278 Y2 JP S5316278Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/60—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H10W72/07551—
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- H10W72/07651—
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- H10W72/50—
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- H10W72/534—
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- H10W72/5363—
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- H10W72/5366—
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- H10W72/5445—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972099164U JPS5316278Y2 (cg-RX-API-DMAC10.html) | 1972-08-25 | 1972-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972099164U JPS5316278Y2 (cg-RX-API-DMAC10.html) | 1972-08-25 | 1972-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4956865U JPS4956865U (cg-RX-API-DMAC10.html) | 1974-05-20 |
| JPS5316278Y2 true JPS5316278Y2 (cg-RX-API-DMAC10.html) | 1978-04-28 |
Family
ID=28301931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972099164U Expired JPS5316278Y2 (cg-RX-API-DMAC10.html) | 1972-08-25 | 1972-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5316278Y2 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826525Y2 (ja) * | 1977-07-18 | 1983-06-08 | 日本電気株式会社 | 半導体装置 |
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1972
- 1972-08-25 JP JP1972099164U patent/JPS5316278Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4956865U (cg-RX-API-DMAC10.html) | 1974-05-20 |