JPS53159273U - - Google Patents
Info
- Publication number
- JPS53159273U JPS53159273U JP1977064248U JP6424877U JPS53159273U JP S53159273 U JPS53159273 U JP S53159273U JP 1977064248 U JP1977064248 U JP 1977064248U JP 6424877 U JP6424877 U JP 6424877U JP S53159273 U JPS53159273 U JP S53159273U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977064248U JPS5826536Y2 (ja) | 1977-05-18 | 1977-05-18 | 積層型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977064248U JPS5826536Y2 (ja) | 1977-05-18 | 1977-05-18 | 積層型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53159273U true JPS53159273U (enExample) | 1978-12-13 |
| JPS5826536Y2 JPS5826536Y2 (ja) | 1983-06-08 |
Family
ID=28968194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977064248U Expired JPS5826536Y2 (ja) | 1977-05-18 | 1977-05-18 | 積層型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826536Y2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4823333U (enExample) * | 1971-07-26 | 1973-03-16 | ||
| JPS5140869A (enExample) * | 1974-10-04 | 1976-04-06 | Nippon Electric Co |
-
1977
- 1977-05-18 JP JP1977064248U patent/JPS5826536Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4823333U (enExample) * | 1971-07-26 | 1973-03-16 | ||
| JPS5140869A (enExample) * | 1974-10-04 | 1976-04-06 | Nippon Electric Co |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5826536Y2 (ja) | 1983-06-08 |