JPS53156B2 - - Google Patents
Info
- Publication number
- JPS53156B2 JPS53156B2 JP13416774A JP13416774A JPS53156B2 JP S53156 B2 JPS53156 B2 JP S53156B2 JP 13416774 A JP13416774 A JP 13416774A JP 13416774 A JP13416774 A JP 13416774A JP S53156 B2 JPS53156 B2 JP S53156B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US471022A US3892092A (en) | 1974-05-17 | 1974-05-17 | Automatic polishing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50160898A JPS50160898A (ja) | 1975-12-26 |
JPS53156B2 true JPS53156B2 (ja) | 1978-01-05 |
Family
ID=23869964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13416774A Expired JPS53156B2 (ja) | 1974-05-17 | 1974-11-21 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3892092A (ja) |
JP (1) | JPS53156B2 (ja) |
FR (1) | FR2271561B1 (ja) |
GB (1) | GB1458476A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10985104B2 (en) | 2018-03-23 | 2021-04-20 | Kabushiki Kaisha Toshiba | Semiconductor device having electrode pad and electrode layer intervening semiconductor layer inbetween and manufacturing method thereof |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4359840A (en) * | 1981-01-07 | 1982-11-23 | The United States Of America As Represented By The United States Department Of Energy | Automatic grinding apparatus to control uniform specimen thicknesses |
US5243791A (en) * | 1989-04-25 | 1993-09-14 | Amp Incorporated | Polishing fixture and method for polishing light emitting devices |
GB2232914B (en) * | 1989-06-15 | 1993-05-26 | British Cast Iron Res Ass | Grinding analytical samples |
DE4027628A1 (de) * | 1990-08-31 | 1992-03-05 | Wolters Peter Fa | Vorrichtung zur steuerung oder regelung von laepp-, hon- oder poliermaschinen |
US5672093A (en) * | 1995-04-21 | 1997-09-30 | Buehler, Ltd. | Specimen load control mechanism for automatic polishing apparatus |
US5697832A (en) * | 1995-10-18 | 1997-12-16 | Cerion Technologies, Inc. | Variable speed bi-directional planetary grinding or polishing apparatus |
EP2381008A2 (en) * | 2006-08-28 | 2011-10-26 | Osaka University | Catalyst-aided chemical processing method and apparatus |
CN107681851B (zh) * | 2017-11-01 | 2019-09-20 | 佛山市顺德区乐普达电机有限公司 | 一种商用空调外机用电机电泳端盖打磨装置 |
CN111633480A (zh) * | 2020-06-25 | 2020-09-08 | 安徽理工大学 | 一种金属打磨装置及其打磨方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US621181A (en) * | 1899-03-14 | Grinding-machine | ||
US1635469A (en) * | 1924-11-03 | 1927-07-12 | Union Special Machine Co | Lapping machine |
US3172241A (en) * | 1963-02-15 | 1965-03-09 | Carl J Habenicht | Lapping machine |
-
1974
- 1974-05-17 US US471022A patent/US3892092A/en not_active Expired - Lifetime
- 1974-10-29 FR FR7436201A patent/FR2271561B1/fr not_active Expired
- 1974-11-15 GB GB4944974A patent/GB1458476A/en not_active Expired
- 1974-11-21 JP JP13416774A patent/JPS53156B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10985104B2 (en) | 2018-03-23 | 2021-04-20 | Kabushiki Kaisha Toshiba | Semiconductor device having electrode pad and electrode layer intervening semiconductor layer inbetween and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
FR2271561B1 (ja) | 1977-03-25 |
JPS50160898A (ja) | 1975-12-26 |
FR2271561A1 (ja) | 1975-12-12 |
GB1458476A (en) | 1976-12-15 |
US3892092A (en) | 1975-07-01 |