JPS53145468U - - Google Patents

Info

Publication number
JPS53145468U
JPS53145468U JP1977051082U JP5108277U JPS53145468U JP S53145468 U JPS53145468 U JP S53145468U JP 1977051082 U JP1977051082 U JP 1977051082U JP 5108277 U JP5108277 U JP 5108277U JP S53145468 U JPS53145468 U JP S53145468U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977051082U
Other languages
Japanese (ja)
Other versions
JPS5756528Y2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977051082U priority Critical patent/JPS5756528Y2/ja
Publication of JPS53145468U publication Critical patent/JPS53145468U/ja
Application granted granted Critical
Publication of JPS5756528Y2 publication Critical patent/JPS5756528Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977051082U 1977-04-19 1977-04-19 Expired JPS5756528Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977051082U JPS5756528Y2 (cg-RX-API-DMAC10.html) 1977-04-19 1977-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977051082U JPS5756528Y2 (cg-RX-API-DMAC10.html) 1977-04-19 1977-04-19

Publications (2)

Publication Number Publication Date
JPS53145468U true JPS53145468U (cg-RX-API-DMAC10.html) 1978-11-16
JPS5756528Y2 JPS5756528Y2 (cg-RX-API-DMAC10.html) 1982-12-04

Family

ID=28939783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977051082U Expired JPS5756528Y2 (cg-RX-API-DMAC10.html) 1977-04-19 1977-04-19

Country Status (1)

Country Link
JP (1) JPS5756528Y2 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device
JPH06334100A (ja) * 1993-05-25 1994-12-02 Seiko Epson Corp 半導体装置及びそのリードフレーム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device
JPH06334100A (ja) * 1993-05-25 1994-12-02 Seiko Epson Corp 半導体装置及びそのリードフレーム

Also Published As

Publication number Publication date
JPS5756528Y2 (cg-RX-API-DMAC10.html) 1982-12-04

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