JPS53142669A - Method of forming laminated layer of multilayer printed circuit board - Google Patents

Method of forming laminated layer of multilayer printed circuit board

Info

Publication number
JPS53142669A
JPS53142669A JP5629977A JP5629977A JPS53142669A JP S53142669 A JPS53142669 A JP S53142669A JP 5629977 A JP5629977 A JP 5629977A JP 5629977 A JP5629977 A JP 5629977A JP S53142669 A JPS53142669 A JP S53142669A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
multilayer printed
laminated layer
forming laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5629977A
Other languages
Japanese (ja)
Inventor
Shinji Umemoto
Hitoshi Nakamura
Mitsuo Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5629977A priority Critical patent/JPS53142669A/en
Publication of JPS53142669A publication Critical patent/JPS53142669A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP5629977A 1977-05-18 1977-05-18 Method of forming laminated layer of multilayer printed circuit board Pending JPS53142669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5629977A JPS53142669A (en) 1977-05-18 1977-05-18 Method of forming laminated layer of multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5629977A JPS53142669A (en) 1977-05-18 1977-05-18 Method of forming laminated layer of multilayer printed circuit board

Publications (1)

Publication Number Publication Date
JPS53142669A true JPS53142669A (en) 1978-12-12

Family

ID=13023230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5629977A Pending JPS53142669A (en) 1977-05-18 1977-05-18 Method of forming laminated layer of multilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS53142669A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006142650A (en) * 2004-11-19 2006-06-08 Canon Chemicals Inc Method and apparatus for heating pipe mold, and rubber roller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006142650A (en) * 2004-11-19 2006-06-08 Canon Chemicals Inc Method and apparatus for heating pipe mold, and rubber roller
JP4693150B2 (en) * 2004-11-19 2011-06-01 キヤノン化成株式会社 Method and apparatus for heating pipe mold

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