JPS53140376U - - Google Patents
Info
- Publication number
- JPS53140376U JPS53140376U JP4712677U JP4712677U JPS53140376U JP S53140376 U JPS53140376 U JP S53140376U JP 4712677 U JP4712677 U JP 4712677U JP 4712677 U JP4712677 U JP 4712677U JP S53140376 U JPS53140376 U JP S53140376U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4712677U JPS5812461Y2 (ja) | 1977-04-13 | 1977-04-13 | 半導体発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4712677U JPS5812461Y2 (ja) | 1977-04-13 | 1977-04-13 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53140376U true JPS53140376U (ja) | 1978-11-06 |
JPS5812461Y2 JPS5812461Y2 (ja) | 1983-03-09 |
Family
ID=28928468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4712677U Expired JPS5812461Y2 (ja) | 1977-04-13 | 1977-04-13 | 半導体発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812461Y2 (ja) |
-
1977
- 1977-04-13 JP JP4712677U patent/JPS5812461Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5812461Y2 (ja) | 1983-03-09 |