JPS53140376U - - Google Patents

Info

Publication number
JPS53140376U
JPS53140376U JP4712677U JP4712677U JPS53140376U JP S53140376 U JPS53140376 U JP S53140376U JP 4712677 U JP4712677 U JP 4712677U JP 4712677 U JP4712677 U JP 4712677U JP S53140376 U JPS53140376 U JP S53140376U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4712677U
Other versions
JPS5812461Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4712677U priority Critical patent/JPS5812461Y2/ja
Publication of JPS53140376U publication Critical patent/JPS53140376U/ja
Application granted granted Critical
Publication of JPS5812461Y2 publication Critical patent/JPS5812461Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP4712677U 1977-04-13 1977-04-13 半導体発光装置 Expired JPS5812461Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4712677U JPS5812461Y2 (ja) 1977-04-13 1977-04-13 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4712677U JPS5812461Y2 (ja) 1977-04-13 1977-04-13 半導体発光装置

Publications (2)

Publication Number Publication Date
JPS53140376U true JPS53140376U (ja) 1978-11-06
JPS5812461Y2 JPS5812461Y2 (ja) 1983-03-09

Family

ID=28928468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4712677U Expired JPS5812461Y2 (ja) 1977-04-13 1977-04-13 半導体発光装置

Country Status (1)

Country Link
JP (1) JPS5812461Y2 (ja)

Also Published As

Publication number Publication date
JPS5812461Y2 (ja) 1983-03-09

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