JPS53139975A - Production of multi-element semiconductor device - Google Patents

Production of multi-element semiconductor device

Info

Publication number
JPS53139975A
JPS53139975A JP5509477A JP5509477A JPS53139975A JP S53139975 A JPS53139975 A JP S53139975A JP 5509477 A JP5509477 A JP 5509477A JP 5509477 A JP5509477 A JP 5509477A JP S53139975 A JPS53139975 A JP S53139975A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
element semiconductor
negated
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5509477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS572176B2 (enrdf_load_stackoverflow
Inventor
Koji Shinohara
Shoji Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5509477A priority Critical patent/JPS53139975A/ja
Publication of JPS53139975A publication Critical patent/JPS53139975A/ja
Publication of JPS572176B2 publication Critical patent/JPS572176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Die Bonding (AREA)
JP5509477A 1977-05-12 1977-05-12 Production of multi-element semiconductor device Granted JPS53139975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5509477A JPS53139975A (en) 1977-05-12 1977-05-12 Production of multi-element semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5509477A JPS53139975A (en) 1977-05-12 1977-05-12 Production of multi-element semiconductor device

Publications (2)

Publication Number Publication Date
JPS53139975A true JPS53139975A (en) 1978-12-06
JPS572176B2 JPS572176B2 (enrdf_load_stackoverflow) 1982-01-14

Family

ID=12989140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5509477A Granted JPS53139975A (en) 1977-05-12 1977-05-12 Production of multi-element semiconductor device

Country Status (1)

Country Link
JP (1) JPS53139975A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131847A (ja) * 1984-11-30 1986-06-19 Nec Kansai Ltd ワ−ク供給方法
JPS6380541A (ja) * 1986-09-24 1988-04-11 Nec Corp マウント装置
JPS63137934U (enrdf_load_stackoverflow) * 1987-02-28 1988-09-12

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131847A (ja) * 1984-11-30 1986-06-19 Nec Kansai Ltd ワ−ク供給方法
JPS6380541A (ja) * 1986-09-24 1988-04-11 Nec Corp マウント装置
JPS63137934U (enrdf_load_stackoverflow) * 1987-02-28 1988-09-12

Also Published As

Publication number Publication date
JPS572176B2 (enrdf_load_stackoverflow) 1982-01-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees