JPS53135428A - Transformer component unit - Google Patents

Transformer component unit

Info

Publication number
JPS53135428A
JPS53135428A JP4861378A JP4861378A JPS53135428A JP S53135428 A JPS53135428 A JP S53135428A JP 4861378 A JP4861378 A JP 4861378A JP 4861378 A JP4861378 A JP 4861378A JP S53135428 A JPS53135428 A JP S53135428A
Authority
JP
Japan
Prior art keywords
component unit
transformer component
transformer
unit
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4861378A
Other languages
Japanese (ja)
Other versions
JPS5927178B2 (en
Inventor
Fuerukeru Hainritsuhi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19762611260 external-priority patent/DE2611260C3/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS53135428A publication Critical patent/JPS53135428A/en
Publication of JPS5927178B2 publication Critical patent/JPS5927178B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP53048613A 1976-03-17 1978-04-24 Converter configuration unit Expired JPS5927178B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19762611260 DE2611260C3 (en) 1976-03-17 1976-03-17 Converter unit
DE19772718967 DE2718967A1 (en) 1976-03-17 1977-04-28 Rectifier unit with at least two diodes per AC phase - has heat sink with ribs on back and on front surface area not occupied by diodes
DE000P27189679 1977-04-28

Publications (2)

Publication Number Publication Date
JPS53135428A true JPS53135428A (en) 1978-11-27
JPS5927178B2 JPS5927178B2 (en) 1984-07-04

Family

ID=39273548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53048613A Expired JPS5927178B2 (en) 1976-03-17 1978-04-24 Converter configuration unit

Country Status (2)

Country Link
JP (1) JPS5927178B2 (en)
DE (1) DE2718967A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2805019C2 (en) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Power supply device for machine tool drives
DE3041656A1 (en) * 1980-11-05 1982-05-13 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR CIRCUIT DESIGN
DD280433A1 (en) * 1989-03-06 1990-07-04 Elektroprojekt Anlagenbau Veb STROMRICHTERGERAET
JPH0671063B2 (en) * 1989-09-11 1994-09-07 株式会社東芝 High power semiconductor device
US5202578A (en) * 1989-09-11 1993-04-13 Kabushiki Kaisha Toshiba Module-type semiconductor device of high power capacity
DE19608677B4 (en) * 1996-03-06 2008-02-07 Vorwerk & Co. Interholding Gmbh Cooling arrangement for arranged on a printed circuit board electronic components
EP4199664A1 (en) * 2021-12-14 2023-06-21 Abb Schweiz Ag Multi-module converter with improved cooling

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH431658A (en) * 1964-12-10 1967-03-15 Marbag Ag Electrical device with electrical components, in particular for industrial control units
DE1514450B2 (en) * 1965-04-23 1976-12-30 Siemens AG, 1000 Berlin und 8000 München RECTIFIER ARRANGEMENT WITH A DISC SEMI-CONDUCTOR RECTIFIER CELL
DE1935220B2 (en) * 1969-07-11 1972-12-07 Semikron Gesellschaft fur Gleich richterbau und Elektronik mbH, 8500 Nurn berg INSULATING MATERIAL SUPPORT PLATE FOR THE CREATION OF CIRCUIT SYSTEMS FOR SEMI-CONDUCTOR RECTIFIER ARRANGEMENTS
DE2008800A1 (en) * 1970-02-21 1971-09-16 Licentia Gmbh Converter cabinet or rack

Also Published As

Publication number Publication date
DE2718967A1 (en) 1978-11-09
JPS5927178B2 (en) 1984-07-04

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