JPS53134859A - Production of embossed plate - Google Patents

Production of embossed plate

Info

Publication number
JPS53134859A
JPS53134859A JP5019477A JP5019477A JPS53134859A JP S53134859 A JPS53134859 A JP S53134859A JP 5019477 A JP5019477 A JP 5019477A JP 5019477 A JP5019477 A JP 5019477A JP S53134859 A JPS53134859 A JP S53134859A
Authority
JP
Japan
Prior art keywords
production
embossed plate
embossed
plates
inexpensibly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5019477A
Other languages
Japanese (ja)
Inventor
Yoshio Shimo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5019477A priority Critical patent/JPS53134859A/en
Publication of JPS53134859A publication Critical patent/JPS53134859A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To produce inexpensibly embossed plates through simple operations by printing thickly metal plates with a thermosetting resin eliminating complicated etching process.
COPYRIGHT: (C)1978,JPO&Japio
JP5019477A 1977-04-30 1977-04-30 Production of embossed plate Pending JPS53134859A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5019477A JPS53134859A (en) 1977-04-30 1977-04-30 Production of embossed plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5019477A JPS53134859A (en) 1977-04-30 1977-04-30 Production of embossed plate

Publications (1)

Publication Number Publication Date
JPS53134859A true JPS53134859A (en) 1978-11-24

Family

ID=12852333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5019477A Pending JPS53134859A (en) 1977-04-30 1977-04-30 Production of embossed plate

Country Status (1)

Country Link
JP (1) JPS53134859A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111262A (en) * 1979-02-20 1980-08-27 Toppan Printing Co Ltd Method of manufacturing embossing plate
JP2009184254A (en) * 2008-02-07 2009-08-20 Kimoto & Co Ltd Method for manufacturing molding die, and molding die
JP2014519993A (en) * 2011-05-11 2014-08-21 ヒューレット−パッカード・インデイゴ・ビー・ブイ Embossing using printed embossed pattern
JP2015501239A (en) * 2011-10-27 2015-01-15 ヒューレット−パッカード・インデイゴ・ビー・ブイＨｅｗｌｅｔｔ−Ｐａｃｋａｒｄ Ｉｎｄｉｇｏ Ｂ．Ｖ． Embossed mold production

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111262A (en) * 1979-02-20 1980-08-27 Toppan Printing Co Ltd Method of manufacturing embossing plate
JP2009184254A (en) * 2008-02-07 2009-08-20 Kimoto & Co Ltd Method for manufacturing molding die, and molding die
JP2014519993A (en) * 2011-05-11 2014-08-21 ヒューレット−パッカード・インデイゴ・ビー・ブイ Embossing using printed embossed pattern
US9296199B2 (en) 2011-05-11 2016-03-29 Hewlett-Packard Indigo B.V. Embossing with printed relief pattern
US10864718B2 (en) 2011-05-11 2020-12-15 Hp Indigo B.V. Embossing with printed relief pattern
JP2015501239A (en) * 2011-10-27 2015-01-15 ヒューレット−パッカード・インデイゴ・ビー・ブイＨｅｗｌｅｔｔ−Ｐａｃｋａｒｄ Ｉｎｄｉｇｏ Ｂ．Ｖ． Embossed mold production

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