JPS5313382B2 - - Google Patents
Info
- Publication number
- JPS5313382B2 JPS5313382B2 JP7825074A JP7825074A JPS5313382B2 JP S5313382 B2 JPS5313382 B2 JP S5313382B2 JP 7825074 A JP7825074 A JP 7825074A JP 7825074 A JP7825074 A JP 7825074A JP S5313382 B2 JPS5313382 B2 JP S5313382B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7825074A JPS5313382B2 (cg-RX-API-DMAC10.html) | 1974-07-10 | 1974-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7825074A JPS5313382B2 (cg-RX-API-DMAC10.html) | 1974-07-10 | 1974-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS518337A JPS518337A (cg-RX-API-DMAC10.html) | 1976-01-23 |
| JPS5313382B2 true JPS5313382B2 (cg-RX-API-DMAC10.html) | 1978-05-10 |
Family
ID=13656741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7825074A Expired JPS5313382B2 (cg-RX-API-DMAC10.html) | 1974-07-10 | 1974-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5313382B2 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56143176A (en) * | 1980-04-08 | 1981-11-07 | Tsuneki Okamoto | Multiple affected part change conduction treating appliance |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334895A (en) * | 1976-09-14 | 1978-03-31 | Hitachi Ltd | Heat resistant and flame retardant resin composition |
| CA1105998A (en) * | 1977-11-07 | 1981-07-28 | Stanley R. Vancelette | Component testing station |
| JPS55130134A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Bonding method of semiconductor pellet |
| JPS5874773A (ja) * | 1981-10-28 | 1983-05-06 | Aisin Chem Co Ltd | 溶接継手の耐食層形成方法 |
| EP1201722A1 (en) * | 2000-10-23 | 2002-05-02 | Loctite (R & D) Limited | Polymerisation initiators, polymerisable compositions, and uses thereof |
| AU2003225512A1 (en) * | 2002-04-19 | 2003-11-03 | Loctite (R And D) Limited | Polymerisation initiators based on ammonium tetraalkyl boranes, polymerisable compositions, and uses thereof for bonding low surface energy substrates |
| CN100497513C (zh) | 2006-03-29 | 2009-06-10 | 湖南神力实业有限公司 | 棒状单包装环氧胶粘剂及制备方法 |
| JP2014097930A (ja) * | 2012-11-13 | 2014-05-29 | San Apro Kk | 熱塩基発生剤 |
-
1974
- 1974-07-10 JP JP7825074A patent/JPS5313382B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56143176A (en) * | 1980-04-08 | 1981-11-07 | Tsuneki Okamoto | Multiple affected part change conduction treating appliance |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS518337A (cg-RX-API-DMAC10.html) | 1976-01-23 |