JPS53130971U - - Google Patents

Info

Publication number
JPS53130971U
JPS53130971U JP1977036686U JP3668677U JPS53130971U JP S53130971 U JPS53130971 U JP S53130971U JP 1977036686 U JP1977036686 U JP 1977036686U JP 3668677 U JP3668677 U JP 3668677U JP S53130971 U JPS53130971 U JP S53130971U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977036686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977036686U priority Critical patent/JPS53130971U/ja
Publication of JPS53130971U publication Critical patent/JPS53130971U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977036686U 1977-03-25 1977-03-25 Pending JPS53130971U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977036686U JPS53130971U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977036686U JPS53130971U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Publications (1)

Publication Number Publication Date
JPS53130971U true JPS53130971U (enrdf_load_stackoverflow) 1978-10-17

Family

ID=28898321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977036686U Pending JPS53130971U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Country Status (1)

Country Link
JP (1) JPS53130971U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138944A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
JP2015126168A (ja) * 2013-12-27 2015-07-06 三菱電機株式会社 パワーモジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866778A (enrdf_load_stackoverflow) * 1971-12-15 1973-09-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866778A (enrdf_load_stackoverflow) * 1971-12-15 1973-09-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138944A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
JP2015126168A (ja) * 2013-12-27 2015-07-06 三菱電機株式会社 パワーモジュール

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