JPS5311835B2 - - Google Patents
Info
- Publication number
- JPS5311835B2 JPS5311835B2 JP9734375A JP9734375A JPS5311835B2 JP S5311835 B2 JPS5311835 B2 JP S5311835B2 JP 9734375 A JP9734375 A JP 9734375A JP 9734375 A JP9734375 A JP 9734375A JP S5311835 B2 JPS5311835 B2 JP S5311835B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9734375A JPS5220782A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor element mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9734375A JPS5220782A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor element mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5220782A JPS5220782A (en) | 1977-02-16 |
| JPS5311835B2 true JPS5311835B2 (enrdf_load_stackoverflow) | 1978-04-25 |
Family
ID=14189822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9734375A Granted JPS5220782A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor element mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5220782A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56161690A (en) * | 1980-05-16 | 1981-12-12 | Fujitsu Ltd | Manufacture of semiconductor laser device |
| JPS5764174U (enrdf_load_stackoverflow) * | 1980-09-30 | 1982-04-16 | ||
| JPS6323386A (ja) * | 1987-07-02 | 1988-01-30 | Fujitsu Ltd | 半導体レ−ザ装置の組立方法 |
| JPH0765308B2 (ja) * | 1988-08-20 | 1995-07-19 | 日本植生株式会社 | 暗キョ排水用疎水材 |
| DE102009040835A1 (de) * | 2009-09-09 | 2011-03-10 | Jenoptik Laserdiode Gmbh | Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung |
| JP2014036165A (ja) * | 2012-08-09 | 2014-02-24 | Shinko Electric Ind Co Ltd | 半導体装置 |
| DE102015002176A1 (de) * | 2015-02-24 | 2016-08-25 | Jenoptik Laser Gmbh | Verfahren zum Herstellen eines Diodenlasers und Diodenlaser |
-
1975
- 1975-08-11 JP JP9734375A patent/JPS5220782A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5220782A (en) | 1977-02-16 |