JPS53112239A - Preparation of copper plated composite rod - Google Patents
Preparation of copper plated composite rodInfo
- Publication number
- JPS53112239A JPS53112239A JP1695177A JP1695177A JPS53112239A JP S53112239 A JPS53112239 A JP S53112239A JP 1695177 A JP1695177 A JP 1695177A JP 1695177 A JP1695177 A JP 1695177A JP S53112239 A JPS53112239 A JP S53112239A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- composite rod
- copper plated
- plated composite
- hoop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0266—Rods, electrodes, wires flux-cored
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/406—Filled tubular wire or rods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE:To obtain a composite rod with a good welding property and a less contact tip abrasion, by carrying out a wet copper plating on a hoop before packing of a powdery material and then packing the powdery material into the hoop.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1695177A JPS53112239A (en) | 1977-02-17 | 1977-02-17 | Preparation of copper plated composite rod |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1695177A JPS53112239A (en) | 1977-02-17 | 1977-02-17 | Preparation of copper plated composite rod |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53112239A true JPS53112239A (en) | 1978-09-30 |
Family
ID=11930422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1695177A Pending JPS53112239A (en) | 1977-02-17 | 1977-02-17 | Preparation of copper plated composite rod |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53112239A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5777388A (en) * | 1995-03-20 | 1998-07-07 | U.S. Philips Corporation | Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
WO2000038876A1 (en) * | 1998-12-23 | 2000-07-06 | Trafilerie Di Cittadella S.P.A. | Method for producing open cored wire for electric arc welding, and plant for implementing the method |
CN101992367A (en) * | 2010-10-21 | 2011-03-30 | 台州海翔焊接材料有限公司 | Method for plating copper on flux-cored wire by electric brush copper |
-
1977
- 1977-02-17 JP JP1695177A patent/JPS53112239A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5777388A (en) * | 1995-03-20 | 1998-07-07 | U.S. Philips Corporation | Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
WO2000038876A1 (en) * | 1998-12-23 | 2000-07-06 | Trafilerie Di Cittadella S.P.A. | Method for producing open cored wire for electric arc welding, and plant for implementing the method |
CN101992367A (en) * | 2010-10-21 | 2011-03-30 | 台州海翔焊接材料有限公司 | Method for plating copper on flux-cored wire by electric brush copper |
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