JPS5311192B2 - - Google Patents
Info
- Publication number
- JPS5311192B2 JPS5311192B2 JP7418372A JP7418372A JPS5311192B2 JP S5311192 B2 JPS5311192 B2 JP S5311192B2 JP 7418372 A JP7418372 A JP 7418372A JP 7418372 A JP7418372 A JP 7418372A JP S5311192 B2 JPS5311192 B2 JP S5311192B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/075—
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- H10W72/01551—
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/07511—
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- H10W72/07521—
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- H10W72/07532—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/932—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7418372A JPS5311192B2 (cg-RX-API-DMAC10.html) | 1972-07-26 | 1972-07-26 | |
| US05/379,972 US4119259A (en) | 1972-07-26 | 1973-07-17 | Automatic bonding apparatus for assembling semiconductor devices |
| GB3426373A GB1433198A (en) | 1972-07-26 | 1973-07-18 | Automatic thermocompression wire bonding apparatus |
| AU58322/73A AU5832273A (en) | 1972-07-26 | 1973-07-20 | Automatic bonding apparatus |
| DE2337303A DE2337303B2 (de) | 1972-07-26 | 1973-07-23 | Automatische Verbindungsvorrichtung insbesondere zum Zusammenbau von Halbleiteranordnungen |
| HK762/76*UA HK76276A (en) | 1972-07-26 | 1976-12-02 | Automatic thermocompression wire bonding apparatus |
| MY101/77A MY7700101A (en) | 1972-07-26 | 1977-12-30 | Automatic thermocompression wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7418372A JPS5311192B2 (cg-RX-API-DMAC10.html) | 1972-07-26 | 1972-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4933565A JPS4933565A (cg-RX-API-DMAC10.html) | 1974-03-28 |
| JPS5311192B2 true JPS5311192B2 (cg-RX-API-DMAC10.html) | 1978-04-19 |
Family
ID=13539787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7418372A Expired JPS5311192B2 (cg-RX-API-DMAC10.html) | 1972-07-26 | 1972-07-26 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4119259A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5311192B2 (cg-RX-API-DMAC10.html) |
| AU (1) | AU5832273A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2337303B2 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1433198A (cg-RX-API-DMAC10.html) |
| HK (1) | HK76276A (cg-RX-API-DMAC10.html) |
| MY (1) | MY7700101A (cg-RX-API-DMAC10.html) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2457746C2 (de) * | 1974-12-06 | 1983-06-16 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung |
| JPS52139016A (en) * | 1976-05-15 | 1977-11-19 | Toei Chemical Kk | Method of manufacturing dimer acid dimethyl ester |
| JPS5323306A (en) * | 1976-08-16 | 1978-03-03 | Toei Chemical Kk | Filteration method of dimer acid dimethyl ester |
| JPS5389659A (en) * | 1977-01-19 | 1978-08-07 | Shinkawa Seisakusho Kk | Wire bonder |
| JPS5416981A (en) * | 1977-07-08 | 1979-02-07 | Shinkawa Seisakusho Kk | Device for bonding wires |
| JPS5826663B2 (ja) * | 1977-07-24 | 1983-06-04 | 株式会社新川 | ワイヤボンディング方法 |
| DE2917110A1 (de) * | 1979-04-27 | 1980-10-30 | Preh Elektro Feinmechanik | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
| US4371105A (en) * | 1980-07-23 | 1983-02-01 | Melton Vernon L | Cam controlled multi-axis automatic welding machine |
| GB8415912D0 (en) * | 1984-06-21 | 1984-07-25 | Abbalong Ltd | Step and repeat apparatus |
| DE3447587A1 (de) * | 1984-12-28 | 1986-07-10 | Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München | Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses |
| DE8714814U1 (de) * | 1987-11-06 | 1989-03-09 | J. Mühlbauer GmbH, 8495 Roding | Die-Bonder |
| US5653375A (en) * | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
| JP6250372B2 (ja) * | 2013-11-22 | 2017-12-20 | Ntn株式会社 | 自動溶接機 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3110425A (en) * | 1961-01-10 | 1963-11-12 | Gen Motors Corp | Fluid dispensing apparatus |
| US3342395A (en) * | 1966-10-10 | 1967-09-19 | Unitek Corp | Precision drive apparatus for a tool mount |
| US3653268A (en) * | 1970-03-10 | 1972-04-04 | John C Diepeveen | Tool moving mechanism |
| US3773240A (en) * | 1972-03-06 | 1973-11-20 | Texas Instruments Inc | Automatic bonding machine |
| US3813022A (en) * | 1972-06-19 | 1974-05-28 | Automated Equipment Corp | Wire bonder apparatus |
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1972
- 1972-07-26 JP JP7418372A patent/JPS5311192B2/ja not_active Expired
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1973
- 1973-07-17 US US05/379,972 patent/US4119259A/en not_active Expired - Lifetime
- 1973-07-18 GB GB3426373A patent/GB1433198A/en not_active Expired
- 1973-07-20 AU AU58322/73A patent/AU5832273A/en not_active Expired
- 1973-07-23 DE DE2337303A patent/DE2337303B2/de active Pending
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1976
- 1976-12-02 HK HK762/76*UA patent/HK76276A/xx unknown
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1977
- 1977-12-30 MY MY101/77A patent/MY7700101A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US4119259A (en) | 1978-10-10 |
| DE2337303B2 (de) | 1975-05-15 |
| HK76276A (en) | 1976-12-10 |
| GB1433198A (en) | 1976-04-22 |
| MY7700101A (en) | 1977-12-31 |
| JPS4933565A (cg-RX-API-DMAC10.html) | 1974-03-28 |
| AU5832273A (en) | 1975-01-23 |
| DE2337303A1 (de) | 1974-02-14 |