JPS53106670U - - Google Patents
Info
- Publication number
- JPS53106670U JPS53106670U JP1977010710U JP1071077U JPS53106670U JP S53106670 U JPS53106670 U JP S53106670U JP 1977010710 U JP1977010710 U JP 1977010710U JP 1071077 U JP1071077 U JP 1071077U JP S53106670 U JPS53106670 U JP S53106670U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977010710U JPS5746600Y2 (https=) | 1977-01-31 | 1977-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977010710U JPS5746600Y2 (https=) | 1977-01-31 | 1977-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53106670U true JPS53106670U (https=) | 1978-08-26 |
| JPS5746600Y2 JPS5746600Y2 (https=) | 1982-10-14 |
Family
ID=28823805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977010710U Expired JPS5746600Y2 (https=) | 1977-01-31 | 1977-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5746600Y2 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519681A (https=) * | 1974-07-15 | 1976-01-26 | Seiko Instr & Electronics |
-
1977
- 1977-01-31 JP JP1977010710U patent/JPS5746600Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519681A (https=) * | 1974-07-15 | 1976-01-26 | Seiko Instr & Electronics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5746600Y2 (https=) | 1982-10-14 |