JPS5310662B2 - - Google Patents
Info
- Publication number
- JPS5310662B2 JPS5310662B2 JP11127072A JP11127072A JPS5310662B2 JP S5310662 B2 JPS5310662 B2 JP S5310662B2 JP 11127072 A JP11127072 A JP 11127072A JP 11127072 A JP11127072 A JP 11127072A JP S5310662 B2 JPS5310662 B2 JP S5310662B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127072A JPS5310662B2 (en:Method) | 1972-11-08 | 1972-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127072A JPS5310662B2 (en:Method) | 1972-11-08 | 1972-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4968262A JPS4968262A (en:Method) | 1974-07-02 |
| JPS5310662B2 true JPS5310662B2 (en:Method) | 1978-04-15 |
Family
ID=14556941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11127072A Expired JPS5310662B2 (en:Method) | 1972-11-08 | 1972-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5310662B2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017076698A (ja) * | 2015-10-15 | 2017-04-20 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498963A (en) * | 1978-01-20 | 1979-08-04 | Tokyo Shibaura Electric Co | Thick film circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700443A (en) * | 1971-04-01 | 1972-10-24 | Litton Systems Inc | Flatpack lead positioning device |
-
1972
- 1972-11-08 JP JP11127072A patent/JPS5310662B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017076698A (ja) * | 2015-10-15 | 2017-04-20 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4968262A (en:Method) | 1974-07-02 |