JPS5310662B2 - - Google Patents

Info

Publication number
JPS5310662B2
JPS5310662B2 JP11127072A JP11127072A JPS5310662B2 JP S5310662 B2 JPS5310662 B2 JP S5310662B2 JP 11127072 A JP11127072 A JP 11127072A JP 11127072 A JP11127072 A JP 11127072A JP S5310662 B2 JPS5310662 B2 JP S5310662B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11127072A
Other versions
JPS4968262A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11127072A priority Critical patent/JPS5310662B2/ja
Publication of JPS4968262A publication Critical patent/JPS4968262A/ja
Publication of JPS5310662B2 publication Critical patent/JPS5310662B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP11127072A 1972-11-08 1972-11-08 Expired JPS5310662B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11127072A JPS5310662B2 (ja) 1972-11-08 1972-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11127072A JPS5310662B2 (ja) 1972-11-08 1972-11-08

Publications (2)

Publication Number Publication Date
JPS4968262A JPS4968262A (ja) 1974-07-02
JPS5310662B2 true JPS5310662B2 (ja) 1978-04-15

Family

ID=14556941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11127072A Expired JPS5310662B2 (ja) 1972-11-08 1972-11-08

Country Status (1)

Country Link
JP (1) JPS5310662B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076698A (ja) * 2015-10-15 2017-04-20 日本特殊陶業株式会社 配線基板およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498963A (en) * 1978-01-20 1979-08-04 Tokyo Shibaura Electric Co Thick film circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700443A (en) * 1971-04-01 1972-10-24 Litton Systems Inc Flatpack lead positioning device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700443A (en) * 1971-04-01 1972-10-24 Litton Systems Inc Flatpack lead positioning device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076698A (ja) * 2015-10-15 2017-04-20 日本特殊陶業株式会社 配線基板およびその製造方法

Also Published As

Publication number Publication date
JPS4968262A (ja) 1974-07-02

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