JPS5310423B2 - - Google Patents
Info
- Publication number
- JPS5310423B2 JPS5310423B2 JP10209274A JP10209274A JPS5310423B2 JP S5310423 B2 JPS5310423 B2 JP S5310423B2 JP 10209274 A JP10209274 A JP 10209274A JP 10209274 A JP10209274 A JP 10209274A JP S5310423 B2 JPS5310423 B2 JP S5310423B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10209274A JPS5310423B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10209274A JPS5310423B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5129868A JPS5129868A (cg-RX-API-DMAC7.html) | 1976-03-13 |
| JPS5310423B2 true JPS5310423B2 (cg-RX-API-DMAC7.html) | 1978-04-13 |
Family
ID=14318120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10209274A Expired JPS5310423B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5310423B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717141A (en) * | 1980-07-04 | 1982-01-28 | Toshiba Corp | Bonding device |
| JPS58210629A (ja) * | 1982-06-02 | 1983-12-07 | Marine Instr Co Ltd | ボンデイング方法及びその装置 |
| JPS599543U (ja) * | 1982-07-12 | 1984-01-21 | 海上電機株式会社 | ボンデイング装置のワイヤ繰り出し量検出機構 |
| JPS5984535A (ja) * | 1982-11-08 | 1984-05-16 | Mitsubishi Electric Corp | ワイヤボンデイング装置におけるワイヤ供給機構 |
-
1974
- 1974-09-06 JP JP10209274A patent/JPS5310423B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5129868A (cg-RX-API-DMAC7.html) | 1976-03-13 |