JPS5310288U - - Google Patents
Info
- Publication number
- JPS5310288U JPS5310288U JP9044776U JP9044776U JPS5310288U JP S5310288 U JPS5310288 U JP S5310288U JP 9044776 U JP9044776 U JP 9044776U JP 9044776 U JP9044776 U JP 9044776U JP S5310288 U JPS5310288 U JP S5310288U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9044776U JPS5310288U (de) | 1976-07-09 | 1976-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9044776U JPS5310288U (de) | 1976-07-09 | 1976-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5310288U true JPS5310288U (de) | 1978-01-27 |
Family
ID=28701064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9044776U Pending JPS5310288U (de) | 1976-07-09 | 1976-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5310288U (de) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247017A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の積層方法 |
| JPH0247019A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の投入装置 |
| JPH0247018A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の成形方法 |
| JPH02114954U (de) * | 1989-03-01 | 1990-09-14 | ||
| JP2006013198A (ja) * | 2004-06-28 | 2006-01-12 | Kyocera Corp | 発光素子収納用パッケージ、発光装置および照明装置 |
| JP2006237190A (ja) * | 2005-02-24 | 2006-09-07 | Toshiba Discrete Technology Kk | 半導体発光装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4814973B1 (de) * | 1966-10-27 | 1973-05-11 | ||
| JPS5027776B2 (de) * | 1972-11-24 | 1975-09-10 |
-
1976
- 1976-07-09 JP JP9044776U patent/JPS5310288U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4814973B1 (de) * | 1966-10-27 | 1973-05-11 | ||
| JPS5027776B2 (de) * | 1972-11-24 | 1975-09-10 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247017A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の積層方法 |
| JPH0247019A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の投入装置 |
| JPH0247018A (ja) * | 1988-08-10 | 1990-02-16 | Honda Motor Co Ltd | 熱可塑性シート材料の成形方法 |
| JPH0583059B2 (de) * | 1988-08-10 | 1993-11-24 | Honda Motor Co Ltd | |
| JPH0583060B2 (de) * | 1988-08-10 | 1993-11-24 | Honda Motor Co Ltd | |
| JPH02114954U (de) * | 1989-03-01 | 1990-09-14 | ||
| JP2006013198A (ja) * | 2004-06-28 | 2006-01-12 | Kyocera Corp | 発光素子収納用パッケージ、発光装置および照明装置 |
| JP4557613B2 (ja) * | 2004-06-28 | 2010-10-06 | 京セラ株式会社 | 発光素子収納用パッケージ、発光装置および照明装置 |
| JP2006237190A (ja) * | 2005-02-24 | 2006-09-07 | Toshiba Discrete Technology Kk | 半導体発光装置 |