JPS5285949U - - Google Patents
Info
- Publication number
- JPS5285949U JPS5285949U JP17356175U JP17356175U JPS5285949U JP S5285949 U JPS5285949 U JP S5285949U JP 17356175 U JP17356175 U JP 17356175U JP 17356175 U JP17356175 U JP 17356175U JP S5285949 U JPS5285949 U JP S5285949U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17356175U JPS5285949U (OSRAM) | 1975-12-24 | 1975-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17356175U JPS5285949U (OSRAM) | 1975-12-24 | 1975-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5285949U true JPS5285949U (OSRAM) | 1977-06-27 |
Family
ID=28651957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17356175U Pending JPS5285949U (OSRAM) | 1975-12-24 | 1975-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5285949U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017511609A (ja) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |
-
1975
- 1975-12-24 JP JP17356175U patent/JPS5285949U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017511609A (ja) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |
| JP2019041129A (ja) * | 2014-04-18 | 2019-03-14 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |