JPS5277839A - Method of etching thin films of alloy of nickel and chromium - Google Patents

Method of etching thin films of alloy of nickel and chromium

Info

Publication number
JPS5277839A
JPS5277839A JP15425575A JP15425575A JPS5277839A JP S5277839 A JPS5277839 A JP S5277839A JP 15425575 A JP15425575 A JP 15425575A JP 15425575 A JP15425575 A JP 15425575A JP S5277839 A JPS5277839 A JP S5277839A
Authority
JP
Japan
Prior art keywords
chromium
nickel
alloy
thin films
etching thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15425575A
Other languages
Japanese (ja)
Inventor
Yukio Morozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP15425575A priority Critical patent/JPS5277839A/en
Publication of JPS5277839A publication Critical patent/JPS5277839A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP15425575A 1975-12-24 1975-12-24 Method of etching thin films of alloy of nickel and chromium Pending JPS5277839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15425575A JPS5277839A (en) 1975-12-24 1975-12-24 Method of etching thin films of alloy of nickel and chromium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15425575A JPS5277839A (en) 1975-12-24 1975-12-24 Method of etching thin films of alloy of nickel and chromium

Publications (1)

Publication Number Publication Date
JPS5277839A true JPS5277839A (en) 1977-06-30

Family

ID=15580202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15425575A Pending JPS5277839A (en) 1975-12-24 1975-12-24 Method of etching thin films of alloy of nickel and chromium

Country Status (1)

Country Link
JP (1) JPS5277839A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285229B2 (en) * 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285229B2 (en) * 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same

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