JPS5277833A - Nonnelectrolytic copper plating solution - Google Patents
Nonnelectrolytic copper plating solutionInfo
- Publication number
- JPS5277833A JPS5277833A JP15330075A JP15330075A JPS5277833A JP S5277833 A JPS5277833 A JP S5277833A JP 15330075 A JP15330075 A JP 15330075A JP 15330075 A JP15330075 A JP 15330075A JP S5277833 A JPS5277833 A JP S5277833A
- Authority
- JP
- Japan
- Prior art keywords
- nonnelectrolytic
- plating solution
- copper plating
- copper
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15330075A JPS5277833A (en) | 1975-12-24 | 1975-12-24 | Nonnelectrolytic copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15330075A JPS5277833A (en) | 1975-12-24 | 1975-12-24 | Nonnelectrolytic copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5277833A true JPS5277833A (en) | 1977-06-30 |
| JPS5551028B2 JPS5551028B2 (enrdf_load_stackoverflow) | 1980-12-22 |
Family
ID=15559451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15330075A Granted JPS5277833A (en) | 1975-12-24 | 1975-12-24 | Nonnelectrolytic copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5277833A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981138U (ja) * | 1982-11-20 | 1984-06-01 | 三洋電機株式会社 | 受信機 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
-
1975
- 1975-12-24 JP JP15330075A patent/JPS5277833A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5551028B2 (enrdf_load_stackoverflow) | 1980-12-22 |
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