JPS5258021A - Nonnelectrolytic nickel plating solution - Google Patents

Nonnelectrolytic nickel plating solution

Info

Publication number
JPS5258021A
JPS5258021A JP51132248A JP13224876A JPS5258021A JP S5258021 A JPS5258021 A JP S5258021A JP 51132248 A JP51132248 A JP 51132248A JP 13224876 A JP13224876 A JP 13224876A JP S5258021 A JPS5258021 A JP S5258021A
Authority
JP
Japan
Prior art keywords
nonnelectrolytic
plating solution
nickel plating
nickel
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51132248A
Other languages
Japanese (ja)
Other versions
JPS5643108B2 (en
Inventor
Giyura Maikeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of JPS5258021A publication Critical patent/JPS5258021A/en
Publication of JPS5643108B2 publication Critical patent/JPS5643108B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP51132248A 1975-11-03 1976-11-02 Nonnelectrolytic nickel plating solution Granted JPS5258021A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62804675A 1975-11-03 1975-11-03

Publications (2)

Publication Number Publication Date
JPS5258021A true JPS5258021A (en) 1977-05-13
JPS5643108B2 JPS5643108B2 (en) 1981-10-09

Family

ID=24517215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51132248A Granted JPS5258021A (en) 1975-11-03 1976-11-02 Nonnelectrolytic nickel plating solution

Country Status (11)

Country Link
JP (1) JPS5258021A (en)
BE (1) BE847908A (en)
BR (1) BR7607356A (en)
CA (1) CA1079454A (en)
DE (1) DE2650389A1 (en)
ES (1) ES452927A1 (en)
FR (1) FR2329762A1 (en)
GB (1) GB1555709A (en)
IT (1) IT1070325B (en)
NL (1) NL7612134A (en)
SE (1) SE429242B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183845A (en) * 2001-10-24 2003-07-03 Shipley Co Llc Stabilizer for electroless plating solution and method for its use

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2531103B1 (en) * 1982-07-30 1985-11-22 Onera (Off Nat Aerospatiale) BATH FOR CHEMICAL DEPOSITION OF NICKEL AND / OR COBALT USING A REDUCER BASED ON BORON OR PHOSPHORUS
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
FR2642670B1 (en) * 1989-02-07 1991-05-24 Eurecat Europ Retrait Catalys METHOD FOR REDUCING A REFINING CATALYST BEFORE IMPLEMENTING IT
US20090239079A1 (en) * 2008-03-18 2009-09-24 Mark Wojtaszek Process for Preventing Plating on a Portion of a Molded Plastic Part
EP3190208B1 (en) * 2016-01-06 2018-09-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183845A (en) * 2001-10-24 2003-07-03 Shipley Co Llc Stabilizer for electroless plating solution and method for its use

Also Published As

Publication number Publication date
BR7607356A (en) 1977-09-20
FR2329762B1 (en) 1979-02-23
CA1079454A (en) 1980-06-17
NL7612134A (en) 1977-05-05
AU1920676A (en) 1978-11-23
DE2650389A1 (en) 1977-05-12
GB1555709A (en) 1979-11-14
IT1070325B (en) 1985-03-29
SE7611917L (en) 1977-05-04
BE847908A (en) 1977-05-03
SE429242B (en) 1983-08-22
FR2329762A1 (en) 1977-05-27
JPS5643108B2 (en) 1981-10-09
ES452927A1 (en) 1978-02-16

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