JPS5277654U - - Google Patents
Info
- Publication number
- JPS5277654U JPS5277654U JP16528075U JP16528075U JPS5277654U JP S5277654 U JPS5277654 U JP S5277654U JP 16528075 U JP16528075 U JP 16528075U JP 16528075 U JP16528075 U JP 16528075U JP S5277654 U JPS5277654 U JP S5277654U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16528075U JPS5277654U (de) | 1975-12-09 | 1975-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16528075U JPS5277654U (de) | 1975-12-09 | 1975-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5277654U true JPS5277654U (de) | 1977-06-09 |
Family
ID=28644023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16528075U Pending JPS5277654U (de) | 1975-12-09 | 1975-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5277654U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55163867A (en) * | 1979-06-07 | 1980-12-20 | Fujitsu Ltd | Lead frame for semiconductor device |
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS63296256A (ja) * | 1987-12-18 | 1988-12-02 | Shinko Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5091264A (de) * | 1973-12-12 | 1975-07-21 |
-
1975
- 1975-12-09 JP JP16528075U patent/JPS5277654U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5091264A (de) * | 1973-12-12 | 1975-07-21 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55163867A (en) * | 1979-06-07 | 1980-12-20 | Fujitsu Ltd | Lead frame for semiconductor device |
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS6220705B2 (de) * | 1981-03-05 | 1987-05-08 | Matsushita Electronics Corp | |
| JPS63296256A (ja) * | 1987-12-18 | 1988-12-02 | Shinko Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法 |