JPS5250278U - - Google Patents
Info
- Publication number
- JPS5250278U JPS5250278U JP13568175U JP13568175U JPS5250278U JP S5250278 U JPS5250278 U JP S5250278U JP 13568175 U JP13568175 U JP 13568175U JP 13568175 U JP13568175 U JP 13568175U JP S5250278 U JPS5250278 U JP S5250278U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13568175U JPS5250278U (enExample) | 1975-10-06 | 1975-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13568175U JPS5250278U (enExample) | 1975-10-06 | 1975-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5250278U true JPS5250278U (enExample) | 1977-04-09 |
Family
ID=28615713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13568175U Pending JPS5250278U (enExample) | 1975-10-06 | 1975-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5250278U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54165647U (enExample) * | 1978-05-15 | 1979-11-20 | ||
| JPWO2007000804A1 (ja) * | 2005-06-27 | 2009-01-22 | 株式会社 ベアック | プリント配線基板の穿孔方法、プリント配線基板、ｂｏｃ用基板及び穿孔装置 |
| JP2009202874A (ja) * | 2008-02-26 | 2009-09-10 | Sanko Kikai Kk | 縦型多列自動包装機における連続包装体の穿孔機構 |
-
1975
- 1975-10-06 JP JP13568175U patent/JPS5250278U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54165647U (enExample) * | 1978-05-15 | 1979-11-20 | ||
| JPWO2007000804A1 (ja) * | 2005-06-27 | 2009-01-22 | 株式会社 ベアック | プリント配線基板の穿孔方法、プリント配線基板、ｂｏｃ用基板及び穿孔装置 |
| JP4646982B2 (ja) * | 2005-06-27 | 2011-03-09 | 株式会社 ベアック | プリント配線基板の穿孔方法 |
| JP2009202874A (ja) * | 2008-02-26 | 2009-09-10 | Sanko Kikai Kk | 縦型多列自動包装機における連続包装体の穿孔機構 |