JPS5249984Y2 - - Google Patents

Info

Publication number
JPS5249984Y2
JPS5249984Y2 JP1973122027U JP12202773U JPS5249984Y2 JP S5249984 Y2 JPS5249984 Y2 JP S5249984Y2 JP 1973122027 U JP1973122027 U JP 1973122027U JP 12202773 U JP12202773 U JP 12202773U JP S5249984 Y2 JPS5249984 Y2 JP S5249984Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1973122027U
Other languages
Japanese (ja)
Other versions
JPS5066574U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973122027U priority Critical patent/JPS5249984Y2/ja
Publication of JPS5066574U publication Critical patent/JPS5066574U/ja
Application granted granted Critical
Publication of JPS5249984Y2 publication Critical patent/JPS5249984Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1973122027U 1973-10-19 1973-10-19 Expired JPS5249984Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973122027U JPS5249984Y2 (https=) 1973-10-19 1973-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973122027U JPS5249984Y2 (https=) 1973-10-19 1973-10-19

Publications (2)

Publication Number Publication Date
JPS5066574U JPS5066574U (https=) 1975-06-14
JPS5249984Y2 true JPS5249984Y2 (https=) 1977-11-12

Family

ID=28366217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973122027U Expired JPS5249984Y2 (https=) 1973-10-19 1973-10-19

Country Status (1)

Country Link
JP (1) JPS5249984Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589585B2 (ja) * 1974-10-04 1983-02-22 日本電気株式会社 デンシブヒンヨウリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS5066574U (https=) 1975-06-14

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