JPS5249308A - Preventing method of peeling between layers - Google Patents
Preventing method of peeling between layersInfo
- Publication number
- JPS5249308A JPS5249308A JP12405275A JP12405275A JPS5249308A JP S5249308 A JPS5249308 A JP S5249308A JP 12405275 A JP12405275 A JP 12405275A JP 12405275 A JP12405275 A JP 12405275A JP S5249308 A JPS5249308 A JP S5249308A
- Authority
- JP
- Japan
- Prior art keywords
- peeling
- layers
- preventing method
- preventing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paper (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12405275A JPS5249308A (en) | 1975-10-15 | 1975-10-15 | Preventing method of peeling between layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12405275A JPS5249308A (en) | 1975-10-15 | 1975-10-15 | Preventing method of peeling between layers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5249308A true JPS5249308A (en) | 1977-04-20 |
| JPS5345411B2 JPS5345411B2 (en:Method) | 1978-12-06 |
Family
ID=14875774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12405275A Granted JPS5249308A (en) | 1975-10-15 | 1975-10-15 | Preventing method of peeling between layers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5249308A (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717142A (en) * | 1980-07-04 | 1982-01-28 | Shimada Phys & Chem Ind Co Ltd | Non-contact measuring method for semiconductor wafer |
| JPH0272646A (ja) * | 1988-09-07 | 1990-03-12 | Mitsubishi Metal Corp | ウェーハ表面の半導体特性測定方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5072982A (en:Method) * | 1973-10-01 | 1975-06-16 | ||
| JPS50127989A (en:Method) * | 1974-03-29 | 1975-10-08 |
-
1975
- 1975-10-15 JP JP12405275A patent/JPS5249308A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5072982A (en:Method) * | 1973-10-01 | 1975-06-16 | ||
| JPS50127989A (en:Method) * | 1974-03-29 | 1975-10-08 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717142A (en) * | 1980-07-04 | 1982-01-28 | Shimada Phys & Chem Ind Co Ltd | Non-contact measuring method for semiconductor wafer |
| JPH0272646A (ja) * | 1988-09-07 | 1990-03-12 | Mitsubishi Metal Corp | ウェーハ表面の半導体特性測定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5345411B2 (en:Method) | 1978-12-06 |
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