JPS5243715B2 - - Google Patents
Info
- Publication number
- JPS5243715B2 JPS5243715B2 JP48099983A JP9998373A JPS5243715B2 JP S5243715 B2 JPS5243715 B2 JP S5243715B2 JP 48099983 A JP48099983 A JP 48099983A JP 9998373 A JP9998373 A JP 9998373A JP S5243715 B2 JPS5243715 B2 JP S5243715B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48099983A JPS5243715B2 (en) | 1973-09-05 | 1973-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48099983A JPS5243715B2 (en) | 1973-09-05 | 1973-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5051397A JPS5051397A (en) | 1975-05-08 |
| JPS5243715B2 true JPS5243715B2 (en) | 1977-11-01 |
Family
ID=14261885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48099983A Expired JPS5243715B2 (en) | 1973-09-05 | 1973-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5243715B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018151287A1 (en) | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate |
-
1973
- 1973-09-05 JP JP48099983A patent/JPS5243715B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018151287A1 (en) | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate |
| KR20190120169A (en) | 2017-02-17 | 2019-10-23 | 히타치가세이가부시끼가이샤 | Method for manufacturing prepreg, laminated board, printed wiring board, coreless substrate, semiconductor package and coreless substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5051397A (en) | 1975-05-08 |