JPS5241192B2 - - Google Patents

Info

Publication number
JPS5241192B2
JPS5241192B2 JP50100442A JP10044275A JPS5241192B2 JP S5241192 B2 JPS5241192 B2 JP S5241192B2 JP 50100442 A JP50100442 A JP 50100442A JP 10044275 A JP10044275 A JP 10044275A JP S5241192 B2 JPS5241192 B2 JP S5241192B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50100442A
Other languages
Japanese (ja)
Other versions
JPS5234670A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50100442A priority Critical patent/JPS5234670A/ja
Publication of JPS5234670A publication Critical patent/JPS5234670A/ja
Publication of JPS5241192B2 publication Critical patent/JPS5241192B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP50100442A 1975-08-18 1975-08-18 Semiconductor device Granted JPS5234670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5234670A JPS5234670A (en) 1977-03-16
JPS5241192B2 true JPS5241192B2 (xx) 1977-10-17

Family

ID=14274036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50100442A Granted JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5234670A (xx)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148589U (xx) * 1977-04-27 1978-11-22
JPS568689Y2 (xx) * 1978-06-22 1981-02-25
JPS5630029B2 (xx) * 1978-06-22 1981-07-11
JPS577747B2 (xx) * 1977-08-13 1982-02-12
JPS61100442U (xx) * 1984-12-04 1986-06-26

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS5689944A (en) * 1979-12-25 1981-07-21 Sumitomo Bakelite Co Thermoocontractive film and its manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148589U (xx) * 1977-04-27 1978-11-22
JPS577747B2 (xx) * 1977-08-13 1982-02-12
JPS568689Y2 (xx) * 1978-06-22 1981-02-25
JPS5630029B2 (xx) * 1978-06-22 1981-07-11
JPS61100442U (xx) * 1984-12-04 1986-06-26

Also Published As

Publication number Publication date
JPS5234670A (en) 1977-03-16

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