JPS5237913B2 - - Google Patents
Info
- Publication number
- JPS5237913B2 JPS5237913B2 JP47103300A JP10330072A JPS5237913B2 JP S5237913 B2 JPS5237913 B2 JP S5237913B2 JP 47103300 A JP47103300 A JP 47103300A JP 10330072 A JP10330072 A JP 10330072A JP S5237913 B2 JPS5237913 B2 JP S5237913B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19543271A | 1971-11-03 | 1971-11-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4858773A JPS4858773A (https=) | 1973-08-17 |
| JPS5237913B2 true JPS5237913B2 (https=) | 1977-09-26 |
Family
ID=22721401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47103300A Expired JPS5237913B2 (https=) | 1971-11-03 | 1972-10-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3781609A (https=) |
| JP (1) | JPS5237913B2 (https=) |
| DE (1) | DE2243809C2 (https=) |
| FR (1) | FR2158230B1 (https=) |
| GB (1) | GB1393423A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103975A (https=) * | 1974-01-16 | 1975-08-16 | ||
| JPS53123074A (en) * | 1977-04-01 | 1978-10-27 | Nec Corp | Semiconductor device |
| US8883565B2 (en) * | 2011-10-04 | 2014-11-11 | Infineon Technologies Ag | Separation of semiconductor devices from a wafer carrier |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458925A (en) * | 1966-01-20 | 1969-08-05 | Ibm | Method of forming solder mounds on substrates |
| US3450965A (en) * | 1966-05-28 | 1969-06-17 | Sony Corp | Semiconductor having reinforced lead structure |
| US3484933A (en) * | 1967-05-04 | 1969-12-23 | North American Rockwell | Face bonding technique |
| JPS4831507B1 (https=) * | 1969-07-10 | 1973-09-29 | ||
| US3591839A (en) * | 1969-08-27 | 1971-07-06 | Siliconix Inc | Micro-electronic circuit with novel hermetic sealing structure and method of manufacture |
| US3656030A (en) * | 1970-09-11 | 1972-04-11 | Rca Corp | Semiconductor device with plurality of small area contacts |
-
1971
- 1971-11-03 US US00195432A patent/US3781609A/en not_active Expired - Lifetime
-
1972
- 1972-09-07 DE DE2243809A patent/DE2243809C2/de not_active Expired
- 1972-09-12 GB GB4227972A patent/GB1393423A/en not_active Expired
- 1972-10-11 FR FR727236797A patent/FR2158230B1/fr not_active Expired
- 1972-10-17 JP JP47103300A patent/JPS5237913B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2243809C2 (de) | 1983-09-29 |
| FR2158230A1 (https=) | 1973-06-15 |
| US3781609A (en) | 1973-12-25 |
| JPS4858773A (https=) | 1973-08-17 |
| GB1393423A (en) | 1975-05-07 |
| FR2158230B1 (https=) | 1979-02-09 |
| DE2243809A1 (de) | 1973-05-10 |