JPS5234345B2 - - Google Patents

Info

Publication number
JPS5234345B2
JPS5234345B2 JP49005953A JP595374A JPS5234345B2 JP S5234345 B2 JPS5234345 B2 JP S5234345B2 JP 49005953 A JP49005953 A JP 49005953A JP 595374 A JP595374 A JP 595374A JP S5234345 B2 JPS5234345 B2 JP S5234345B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49005953A
Other languages
Japanese (ja)
Other versions
JPS50103278A (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49005953A priority Critical patent/JPS5234345B2/ja
Publication of JPS50103278A publication Critical patent/JPS50103278A/ja
Publication of JPS5234345B2 publication Critical patent/JPS5234345B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Die Bonding (AREA)
JP49005953A 1974-01-11 1974-01-11 Expired JPS5234345B2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49005953A JPS5234345B2 (cg-RX-API-DMAC7.html) 1974-01-11 1974-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49005953A JPS5234345B2 (cg-RX-API-DMAC7.html) 1974-01-11 1974-01-11

Publications (2)

Publication Number Publication Date
JPS50103278A JPS50103278A (cg-RX-API-DMAC7.html) 1975-08-15
JPS5234345B2 true JPS5234345B2 (cg-RX-API-DMAC7.html) 1977-09-02

Family

ID=11625245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49005953A Expired JPS5234345B2 (cg-RX-API-DMAC7.html) 1974-01-11 1974-01-11

Country Status (1)

Country Link
JP (1) JPS5234345B2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101225U (ja) * 1983-12-16 1985-07-10 いすゞ自動車株式会社 伸縮可能な伝導軸の防塵装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103157U (cg-RX-API-DMAC7.html) * 1977-12-13 1979-07-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101225U (ja) * 1983-12-16 1985-07-10 いすゞ自動車株式会社 伸縮可能な伝導軸の防塵装置

Also Published As

Publication number Publication date
JPS50103278A (cg-RX-API-DMAC7.html) 1975-08-15

Similar Documents

Publication Publication Date Title
FI753483A7 (cg-RX-API-DMAC7.html)
FR2258594B1 (cg-RX-API-DMAC7.html)
FI750416A7 (cg-RX-API-DMAC7.html)
DK28575A (cg-RX-API-DMAC7.html)
FR2258809B3 (cg-RX-API-DMAC7.html)
FR2257260B1 (cg-RX-API-DMAC7.html)
DK477875A (cg-RX-API-DMAC7.html)
JPS5234345B2 (cg-RX-API-DMAC7.html)
FR2258170A1 (cg-RX-API-DMAC7.html)
DK139711C (cg-RX-API-DMAC7.html)
FI751890A7 (cg-RX-API-DMAC7.html)
AR199073A1 (cg-RX-API-DMAC7.html)
DE2433320A1 (cg-RX-API-DMAC7.html)
DE2417483A1 (cg-RX-API-DMAC7.html)
CS169734B1 (cg-RX-API-DMAC7.html)
AR197698Q (cg-RX-API-DMAC7.html)
CS173361B1 (cg-RX-API-DMAC7.html)
CS170606B1 (cg-RX-API-DMAC7.html)
BG19987A1 (cg-RX-API-DMAC7.html)
AU481606A (cg-RX-API-DMAC7.html)
CH572509A5 (cg-RX-API-DMAC7.html)
BG20225A1 (cg-RX-API-DMAC7.html)
BG19999A1 (cg-RX-API-DMAC7.html)
AU481898A (cg-RX-API-DMAC7.html)
BG19967A1 (cg-RX-API-DMAC7.html)