JPS5234345B2 - - Google Patents

Info

Publication number
JPS5234345B2
JPS5234345B2 JP49005953A JP595374A JPS5234345B2 JP S5234345 B2 JPS5234345 B2 JP S5234345B2 JP 49005953 A JP49005953 A JP 49005953A JP 595374 A JP595374 A JP 595374A JP S5234345 B2 JPS5234345 B2 JP S5234345B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49005953A
Other versions
JPS50103278A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49005953A priority Critical patent/JPS5234345B2/ja
Publication of JPS50103278A publication Critical patent/JPS50103278A/ja
Publication of JPS5234345B2 publication Critical patent/JPS5234345B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Die Bonding (AREA)
JP49005953A 1974-01-11 1974-01-11 Expired JPS5234345B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49005953A JPS5234345B2 (ja) 1974-01-11 1974-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49005953A JPS5234345B2 (ja) 1974-01-11 1974-01-11

Publications (2)

Publication Number Publication Date
JPS50103278A JPS50103278A (ja) 1975-08-15
JPS5234345B2 true JPS5234345B2 (ja) 1977-09-02

Family

ID=11625245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49005953A Expired JPS5234345B2 (ja) 1974-01-11 1974-01-11

Country Status (1)

Country Link
JP (1) JPS5234345B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101225U (ja) * 1983-12-16 1985-07-10 いすゞ自動車株式会社 伸縮可能な伝導軸の防塵装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103157U (ja) * 1977-12-13 1979-07-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101225U (ja) * 1983-12-16 1985-07-10 いすゞ自動車株式会社 伸縮可能な伝導軸の防塵装置

Also Published As

Publication number Publication date
JPS50103278A (ja) 1975-08-15

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