JPS5233814Y2 - - Google Patents
Info
- Publication number
- JPS5233814Y2 JPS5233814Y2 JP278472U JP278472U JPS5233814Y2 JP S5233814 Y2 JPS5233814 Y2 JP S5233814Y2 JP 278472 U JP278472 U JP 278472U JP 278472 U JP278472 U JP 278472U JP S5233814 Y2 JPS5233814 Y2 JP S5233814Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP278472U JPS5233814Y2 (ko) | 1971-12-29 | 1971-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP278472U JPS5233814Y2 (ko) | 1971-12-29 | 1971-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4881767U JPS4881767U (ko) | 1973-10-05 |
| JPS5233814Y2 true JPS5233814Y2 (ko) | 1977-08-02 |
Family
ID=33092593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP278472U Expired JPS5233814Y2 (ko) | 1971-12-29 | 1971-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5233814Y2 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821179Y2 (ja) * | 1976-09-20 | 1983-05-04 | 日本電気株式会社 | 半導体部品の放熱装置 |
| JPS5722444Y2 (ko) * | 1978-02-10 | 1982-05-15 | ||
| JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
-
1971
- 1971-12-29 JP JP278472U patent/JPS5233814Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4881767U (ko) | 1973-10-05 |