JPS5233269U - - Google Patents

Info

Publication number
JPS5233269U
JPS5233269U JP11941875U JP11941875U JPS5233269U JP S5233269 U JPS5233269 U JP S5233269U JP 11941875 U JP11941875 U JP 11941875U JP 11941875 U JP11941875 U JP 11941875U JP S5233269 U JPS5233269 U JP S5233269U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11941875U
Other languages
Japanese (ja)
Other versions
JPS5623901Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975119418U priority Critical patent/JPS5623901Y2/ja
Publication of JPS5233269U publication Critical patent/JPS5233269U/ja
Application granted granted Critical
Publication of JPS5623901Y2 publication Critical patent/JPS5623901Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1975119418U 1975-08-29 1975-08-29 Expired JPS5623901Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975119418U JPS5623901Y2 (enrdf_load_stackoverflow) 1975-08-29 1975-08-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975119418U JPS5623901Y2 (enrdf_load_stackoverflow) 1975-08-29 1975-08-29

Publications (2)

Publication Number Publication Date
JPS5233269U true JPS5233269U (enrdf_load_stackoverflow) 1977-03-09
JPS5623901Y2 JPS5623901Y2 (enrdf_load_stackoverflow) 1981-06-04

Family

ID=28600225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975119418U Expired JPS5623901Y2 (enrdf_load_stackoverflow) 1975-08-29 1975-08-29

Country Status (1)

Country Link
JP (1) JPS5623901Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175440U (ja) * 1982-05-18 1983-11-24 有限会社第一技研 容器の漏れ検査装置
JPS62274233A (ja) * 1986-05-23 1987-11-28 Ryusaburo Koreeda 漏洩試験機
JPH05223680A (ja) * 1992-02-17 1993-08-31 Akuson Data Mach Kk 密閉容器の漏れ検出装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109478U (enrdf_load_stackoverflow) * 1973-01-13 1974-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109478U (enrdf_load_stackoverflow) * 1973-01-13 1974-09-19

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175440U (ja) * 1982-05-18 1983-11-24 有限会社第一技研 容器の漏れ検査装置
JPS62274233A (ja) * 1986-05-23 1987-11-28 Ryusaburo Koreeda 漏洩試験機
JPH05223680A (ja) * 1992-02-17 1993-08-31 Akuson Data Mach Kk 密閉容器の漏れ検出装置

Also Published As

Publication number Publication date
JPS5623901Y2 (enrdf_load_stackoverflow) 1981-06-04

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