JPS523275B2 - - Google Patents
Info
- Publication number
- JPS523275B2 JPS523275B2 JP49088355A JP8835574A JPS523275B2 JP S523275 B2 JPS523275 B2 JP S523275B2 JP 49088355 A JP49088355 A JP 49088355A JP 8835574 A JP8835574 A JP 8835574A JP S523275 B2 JPS523275 B2 JP S523275B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49088355A JPS523275B2 (en) | 1974-07-31 | 1974-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49088355A JPS523275B2 (en) | 1974-07-31 | 1974-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5116877A JPS5116877A (en) | 1976-02-10 |
| JPS523275B2 true JPS523275B2 (en) | 1977-01-27 |
Family
ID=13940496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49088355A Expired JPS523275B2 (en) | 1974-07-31 | 1974-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS523275B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333892A (en) * | 1976-09-03 | 1978-03-30 | Mitsui Miike Machinery Co Ltd | Bait supplier for fish culture |
| JPS5441671A (en) * | 1977-09-08 | 1979-04-03 | Sharp Corp | Semiconductor device |
| JPS5910753Y2 (en) * | 1977-09-22 | 1984-04-04 | シャープ株式会社 | semiconductor equipment |
| US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
| JPS629723Y2 (en) * | 1981-02-20 | 1987-03-06 | ||
| JPS63190363A (en) * | 1987-02-02 | 1988-08-05 | Matsushita Electronics Corp | Power package |
| JPH01214032A (en) * | 1988-02-22 | 1989-08-28 | Canon Inc | Electric circuit device |
| JPS6442828A (en) * | 1987-08-10 | 1989-02-15 | Rohm Co Ltd | Semiconductor device |
| JPH0624212B2 (en) * | 1989-10-09 | 1994-03-30 | ローム株式会社 | Electronic parts |
| JPH04307760A (en) * | 1991-04-04 | 1992-10-29 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
-
1974
- 1974-07-31 JP JP49088355A patent/JPS523275B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5116877A (en) | 1976-02-10 |