JPS5231279B2 - - Google Patents

Info

Publication number
JPS5231279B2
JPS5231279B2 JP3891574A JP3891574A JPS5231279B2 JP S5231279 B2 JPS5231279 B2 JP S5231279B2 JP 3891574 A JP3891574 A JP 3891574A JP 3891574 A JP3891574 A JP 3891574A JP S5231279 B2 JPS5231279 B2 JP S5231279B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3891574A
Other languages
Japanese (ja)
Other versions
JPS50132099A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3891574A priority Critical patent/JPS5231279B2/ja
Priority to SE7503044A priority patent/SE421006B/en
Priority to US05/559,650 priority patent/US4110364A/en
Priority to GB11472/75A priority patent/GB1499098A/en
Priority to DE19752512085 priority patent/DE2512085C3/en
Publication of JPS50132099A publication Critical patent/JPS50132099A/ja
Publication of JPS5231279B2 publication Critical patent/JPS5231279B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP3891574A 1974-03-19 1974-04-08 Expired JPS5231279B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3891574A JPS5231279B2 (en) 1974-04-08 1974-04-08
SE7503044A SE421006B (en) 1974-03-19 1975-03-18 HARDWARE COMPOSITION OF A CYANATE TESTER COMPONENT AND A BISMALEIC ACID MEMBER COMPONENT
US05/559,650 US4110364A (en) 1974-03-19 1975-03-18 Curable resin compositions of cyanate esters
GB11472/75A GB1499098A (en) 1974-03-19 1975-03-19 Curable resin compositions
DE19752512085 DE2512085C3 (en) 1974-03-19 1975-03-19 Curable resin compositions based on a bismaleimide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3891574A JPS5231279B2 (en) 1974-04-08 1974-04-08

Publications (2)

Publication Number Publication Date
JPS50132099A JPS50132099A (en) 1975-10-18
JPS5231279B2 true JPS5231279B2 (en) 1977-08-13

Family

ID=12538490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3891574A Expired JPS5231279B2 (en) 1974-03-19 1974-04-08

Country Status (1)

Country Link
JP (1) JPS5231279B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018190292A1 (en) * 2017-04-10 2018-10-18 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471197A (en) * 1977-11-18 1979-06-07 Mitsui Toatsu Chem Inc Curable resin composition
JPS5473900A (en) * 1977-11-25 1979-06-13 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS54158498A (en) * 1978-06-05 1979-12-14 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS5558224A (en) * 1978-10-26 1980-04-30 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS55145766A (en) * 1979-04-30 1980-11-13 Toshiba Chem Corp Solventless type varnish for electric insulation
JPS5634840U (en) * 1979-08-22 1981-04-04
JPS59140279A (en) * 1983-02-01 1984-08-11 Toshiba Chem Corp Solventless electrically conductive adhesive
JPH0615603B2 (en) * 1986-10-03 1994-03-02 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation
CN101133118B (en) 2005-03-07 2011-03-02 三井化学株式会社 Cyclic olefin resin composition, and substrate provided from said resin composition
ES2740952T3 (en) 2011-10-18 2020-02-07 Guangdong Shengyi Sci Tech Co Composition of epoxy resin and high frequency electronic circuit substrate manufactured using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018190292A1 (en) * 2017-04-10 2018-10-18 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board

Also Published As

Publication number Publication date
JPS50132099A (en) 1975-10-18

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