JPS5231279B2 - - Google Patents
Info
- Publication number
- JPS5231279B2 JPS5231279B2 JP3891574A JP3891574A JPS5231279B2 JP S5231279 B2 JPS5231279 B2 JP S5231279B2 JP 3891574 A JP3891574 A JP 3891574A JP 3891574 A JP3891574 A JP 3891574A JP S5231279 B2 JPS5231279 B2 JP S5231279B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3891574A JPS5231279B2 (en) | 1974-04-08 | 1974-04-08 | |
| SE7503044A SE421006B (en) | 1974-03-19 | 1975-03-18 | HARDWARE COMPOSITION OF A CYANATE TESTER COMPONENT AND A BISMALEIC ACID MEMBER COMPONENT |
| US05/559,650 US4110364A (en) | 1974-03-19 | 1975-03-18 | Curable resin compositions of cyanate esters |
| DE19752512085 DE2512085C3 (en) | 1974-03-19 | 1975-03-19 | Curable resin compositions based on a bismaleimide |
| GB11472/75A GB1499098A (en) | 1974-03-19 | 1975-03-19 | Curable resin compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3891574A JPS5231279B2 (en) | 1974-04-08 | 1974-04-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50132099A JPS50132099A (en) | 1975-10-18 |
| JPS5231279B2 true JPS5231279B2 (en) | 1977-08-13 |
Family
ID=12538490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3891574A Expired JPS5231279B2 (en) | 1974-03-19 | 1974-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5231279B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018190292A1 (en) * | 2017-04-10 | 2018-10-18 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471197A (en) * | 1977-11-18 | 1979-06-07 | Mitsui Toatsu Chem Inc | Curable resin composition |
| JPS5473900A (en) * | 1977-11-25 | 1979-06-13 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
| JPS54158498A (en) * | 1978-06-05 | 1979-12-14 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
| JPS5558224A (en) * | 1978-10-26 | 1980-04-30 | Mitsubishi Gas Chem Co Inc | Curable resin composition |
| JPS55145766A (en) * | 1979-04-30 | 1980-11-13 | Toshiba Chem Corp | Solventless type varnish for electric insulation |
| JPS5634840U (en) * | 1979-08-22 | 1981-04-04 | ||
| JPS59140279A (en) * | 1983-02-01 | 1984-08-11 | Toshiba Chem Corp | Solventless electrically conductive adhesive |
| JPH0615603B2 (en) * | 1986-10-03 | 1994-03-02 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation |
| US20080249235A1 (en) | 2005-03-07 | 2008-10-09 | Mitsui Chemicals, Inc. | Cyclic Olefin Resin Composition, and Substrate Obtained From Said Resin Composition |
| ES2740952T3 (en) | 2011-10-18 | 2020-02-07 | Guangdong Shengyi Sci Tech Co | Composition of epoxy resin and high frequency electronic circuit substrate manufactured using the same |
-
1974
- 1974-04-08 JP JP3891574A patent/JPS5231279B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018190292A1 (en) * | 2017-04-10 | 2018-10-18 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50132099A (en) | 1975-10-18 |