JPS5227995B2 - - Google Patents
Info
- Publication number
- JPS5227995B2 JPS5227995B2 JP6276771A JP6276771A JPS5227995B2 JP S5227995 B2 JPS5227995 B2 JP S5227995B2 JP 6276771 A JP6276771 A JP 6276771A JP 6276771 A JP6276771 A JP 6276771A JP S5227995 B2 JPS5227995 B2 JP S5227995B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6276771A JPS5227995B2 (zh) | 1971-08-18 | 1971-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6276771A JPS5227995B2 (zh) | 1971-08-18 | 1971-08-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4829383A JPS4829383A (zh) | 1973-04-18 |
| JPS5227995B2 true JPS5227995B2 (zh) | 1977-07-23 |
Family
ID=13209851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6276771A Expired JPS5227995B2 (zh) | 1971-08-18 | 1971-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5227995B2 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10775281B2 (en) | 2012-01-23 | 2020-09-15 | Ventana Medical Systems, Inc. | Polymer stabilization of chromogen solutions |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113589A (zh) * | 1974-07-25 | 1976-02-03 | Tokyo Shibaura Electric Co | |
| JPS5314470U (zh) * | 1976-07-19 | 1978-02-06 | ||
| JPS53138287A (en) * | 1977-05-10 | 1978-12-02 | Agency Of Ind Science & Technol | Solar battery |
| CN101789482B (zh) | 2003-03-10 | 2013-04-17 | 丰田合成株式会社 | 固体元件装置及其制造方法 |
| JP4029843B2 (ja) | 2004-01-19 | 2008-01-09 | 豊田合成株式会社 | 発光装置 |
| JP4008943B2 (ja) * | 2003-03-10 | 2007-11-14 | 豊田合成株式会社 | 固体素子デバイスの製造方法 |
| JP4358713B2 (ja) * | 2004-09-09 | 2009-11-04 | 株式会社住田光学ガラス | 固体素子デバイス |
| DE102005042778A1 (de) | 2004-09-09 | 2006-04-13 | Toyoda Gosei Co., Ltd., Nishikasugai | Optische Festkörpervorrichtung |
| JP4394036B2 (ja) * | 2004-09-09 | 2010-01-06 | 豊田合成株式会社 | 固体素子デバイス |
-
1971
- 1971-08-18 JP JP6276771A patent/JPS5227995B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10775281B2 (en) | 2012-01-23 | 2020-09-15 | Ventana Medical Systems, Inc. | Polymer stabilization of chromogen solutions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4829383A (zh) | 1973-04-18 |