JPS5224289A - Process for preparing copper-plated laminated sheet - Google Patents

Process for preparing copper-plated laminated sheet

Info

Publication number
JPS5224289A
JPS5224289A JP10087375A JP10087375A JPS5224289A JP S5224289 A JPS5224289 A JP S5224289A JP 10087375 A JP10087375 A JP 10087375A JP 10087375 A JP10087375 A JP 10087375A JP S5224289 A JPS5224289 A JP S5224289A
Authority
JP
Japan
Prior art keywords
laminated sheet
preparing copper
plated laminated
copper
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10087375A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5416976B2 (en:Method
Inventor
Akio Takahashi
Motoyo Wajima
Nobuhiro Sato
Ritsuro Tada
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP10087375A priority Critical patent/JPS5224289A/ja
Publication of JPS5224289A publication Critical patent/JPS5224289A/ja
Publication of JPS5416976B2 publication Critical patent/JPS5416976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10087375A 1975-08-20 1975-08-20 Process for preparing copper-plated laminated sheet Granted JPS5224289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10087375A JPS5224289A (en) 1975-08-20 1975-08-20 Process for preparing copper-plated laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10087375A JPS5224289A (en) 1975-08-20 1975-08-20 Process for preparing copper-plated laminated sheet

Publications (2)

Publication Number Publication Date
JPS5224289A true JPS5224289A (en) 1977-02-23
JPS5416976B2 JPS5416976B2 (en:Method) 1979-06-26

Family

ID=14285424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10087375A Granted JPS5224289A (en) 1975-08-20 1975-08-20 Process for preparing copper-plated laminated sheet

Country Status (1)

Country Link
JP (1) JPS5224289A (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000117A1 (fr) * 1978-06-14 1980-01-24 Sumitomo Bakelite Co Substrat pour circuit imprime flexible et sa methode de fabrication
WO2016158829A1 (ja) * 2015-03-31 2016-10-06 ナミックス株式会社 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置
JP2019137813A (ja) * 2018-02-14 2019-08-22 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP2019142783A (ja) * 2018-02-15 2019-08-29 日立化成株式会社 ビスマレイミド化合物とその中間体、並びに、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000117A1 (fr) * 1978-06-14 1980-01-24 Sumitomo Bakelite Co Substrat pour circuit imprime flexible et sa methode de fabrication
WO2016158829A1 (ja) * 2015-03-31 2016-10-06 ナミックス株式会社 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置
JP2019137813A (ja) * 2018-02-14 2019-08-22 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP2019142783A (ja) * 2018-02-15 2019-08-29 日立化成株式会社 ビスマレイミド化合物とその中間体、並びに、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ

Also Published As

Publication number Publication date
JPS5416976B2 (en:Method) 1979-06-26

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