JPS5223552B2 - - Google Patents
Info
- Publication number
- JPS5223552B2 JPS5223552B2 JP8529471A JP8529471A JPS5223552B2 JP S5223552 B2 JPS5223552 B2 JP S5223552B2 JP 8529471 A JP8529471 A JP 8529471A JP 8529471 A JP8529471 A JP 8529471A JP S5223552 B2 JPS5223552 B2 JP S5223552B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529471A JPS5223552B2 (ja) | 1971-10-27 | 1971-10-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529471A JPS5223552B2 (ja) | 1971-10-27 | 1971-10-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4851593A JPS4851593A (ja) | 1973-07-19 |
JPS5223552B2 true JPS5223552B2 (ja) | 1977-06-24 |
Family
ID=13854546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8529471A Expired JPS5223552B2 (ja) | 1971-10-27 | 1971-10-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5223552B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2605526B2 (ja) * | 1991-10-11 | 1997-04-30 | 松下電器産業株式会社 | 携帯電話機の受信装置 |
-
1971
- 1971-10-27 JP JP8529471A patent/JPS5223552B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS4851593A (ja) | 1973-07-19 |