JPS5220230B2 - - Google Patents

Info

Publication number
JPS5220230B2
JPS5220230B2 JP48069729A JP6972973A JPS5220230B2 JP S5220230 B2 JPS5220230 B2 JP S5220230B2 JP 48069729 A JP48069729 A JP 48069729A JP 6972973 A JP6972973 A JP 6972973A JP S5220230 B2 JPS5220230 B2 JP S5220230B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48069729A
Other languages
Japanese (ja)
Other versions
JPS5020664A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48069729A priority Critical patent/JPS5220230B2/ja
Priority to US481458A priority patent/US3908186A/en
Publication of JPS5020664A publication Critical patent/JPS5020664A/ja
Priority to US05/729,286 priority patent/USRE29218E/en
Publication of JPS5220230B2 publication Critical patent/JPS5220230B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/20Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Waveguides (AREA)
JP48069729A 1973-06-22 1973-06-22 Expired JPS5220230B2 (https=)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP48069729A JPS5220230B2 (https=) 1973-06-22 1973-06-22
US481458A US3908186A (en) 1973-06-22 1974-06-20 Packaged semiconductor device for microwave use
US05/729,286 USRE29218E (en) 1973-06-22 1976-10-04 Packaged semiconductor device for microwave use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48069729A JPS5220230B2 (https=) 1973-06-22 1973-06-22

Publications (2)

Publication Number Publication Date
JPS5020664A JPS5020664A (https=) 1975-03-05
JPS5220230B2 true JPS5220230B2 (https=) 1977-06-02

Family

ID=13411198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48069729A Expired JPS5220230B2 (https=) 1973-06-22 1973-06-22

Country Status (2)

Country Link
US (1) US3908186A (https=)
JP (1) JPS5220230B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536658U (https=) * 1976-07-03 1978-01-20
JPS5756527Y2 (https=) * 1977-02-25 1982-12-04
US4987101A (en) * 1988-12-16 1991-01-22 International Business Machines Corporation Method for providing improved insulation in VLSI and ULSI circuits
JP2810647B2 (ja) * 1996-04-30 1998-10-15 山一電機株式会社 Icパッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices

Also Published As

Publication number Publication date
JPS5020664A (https=) 1975-03-05
US3908186A (en) 1975-09-23

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