JPS5020664A - - Google Patents
Info
- Publication number
- JPS5020664A JPS5020664A JP48069729A JP6972973A JPS5020664A JP S5020664 A JPS5020664 A JP S5020664A JP 48069729 A JP48069729 A JP 48069729A JP 6972973 A JP6972973 A JP 6972973A JP S5020664 A JPS5020664 A JP S5020664A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Waveguides (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48069729A JPS5220230B2 (https=) | 1973-06-22 | 1973-06-22 | |
| US481458A US3908186A (en) | 1973-06-22 | 1974-06-20 | Packaged semiconductor device for microwave use |
| US05/729,286 USRE29218E (en) | 1973-06-22 | 1976-10-04 | Packaged semiconductor device for microwave use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48069729A JPS5220230B2 (https=) | 1973-06-22 | 1973-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5020664A true JPS5020664A (https=) | 1975-03-05 |
| JPS5220230B2 JPS5220230B2 (https=) | 1977-06-02 |
Family
ID=13411198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48069729A Expired JPS5220230B2 (https=) | 1973-06-22 | 1973-06-22 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3908186A (https=) |
| JP (1) | JPS5220230B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536658U (https=) * | 1976-07-03 | 1978-01-20 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756527Y2 (https=) * | 1977-02-25 | 1982-12-04 | ||
| US4987101A (en) * | 1988-12-16 | 1991-01-22 | International Business Machines Corporation | Method for providing improved insulation in VLSI and ULSI circuits |
| JP2810647B2 (ja) * | 1996-04-30 | 1998-10-15 | 山一電機株式会社 | Ｉｃパッケージ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
| US3483308A (en) * | 1968-10-24 | 1969-12-09 | Texas Instruments Inc | Modular packages for semiconductor devices |
-
1973
- 1973-06-22 JP JP48069729A patent/JPS5220230B2/ja not_active Expired
-
1974
- 1974-06-20 US US481458A patent/US3908186A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536658U (https=) * | 1976-07-03 | 1978-01-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| US3908186A (en) | 1975-09-23 |
| JPS5220230B2 (https=) | 1977-06-02 |