JPS52166462U - - Google Patents
Info
- Publication number
- JPS52166462U JPS52166462U JP1976074831U JP7483176U JPS52166462U JP S52166462 U JPS52166462 U JP S52166462U JP 1976074831 U JP1976074831 U JP 1976074831U JP 7483176 U JP7483176 U JP 7483176U JP S52166462 U JPS52166462 U JP S52166462U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976074831U JPS52166462U (en:Method) | 1976-06-09 | 1976-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976074831U JPS52166462U (en:Method) | 1976-06-09 | 1976-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52166462U true JPS52166462U (en:Method) | 1977-12-16 |
Family
ID=28548359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976074831U Pending JPS52166462U (en:Method) | 1976-06-09 | 1976-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52166462U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012222159A (ja) * | 2011-04-08 | 2012-11-12 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4824525U (en:Method) * | 1971-07-27 | 1973-03-22 |
-
1976
- 1976-06-09 JP JP1976074831U patent/JPS52166462U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4824525U (en:Method) * | 1971-07-27 | 1973-03-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012222159A (ja) * | 2011-04-08 | 2012-11-12 | Denso Corp | 半導体装置及び半導体装置の製造方法 |