JPS52164452U - - Google Patents

Info

Publication number
JPS52164452U
JPS52164452U JP1976074492U JP7449276U JPS52164452U JP S52164452 U JPS52164452 U JP S52164452U JP 1976074492 U JP1976074492 U JP 1976074492U JP 7449276 U JP7449276 U JP 7449276U JP S52164452 U JPS52164452 U JP S52164452U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976074492U
Other languages
Japanese (ja)
Other versions
JPS5653552Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976074492U priority Critical patent/JPS5653552Y2/ja
Publication of JPS52164452U publication Critical patent/JPS52164452U/ja
Application granted granted Critical
Publication of JPS5653552Y2 publication Critical patent/JPS5653552Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1976074492U 1976-06-08 1976-06-08 Expired JPS5653552Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976074492U JPS5653552Y2 (https=) 1976-06-08 1976-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976074492U JPS5653552Y2 (https=) 1976-06-08 1976-06-08

Publications (2)

Publication Number Publication Date
JPS52164452U true JPS52164452U (https=) 1977-12-13
JPS5653552Y2 JPS5653552Y2 (https=) 1981-12-14

Family

ID=28547720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976074492U Expired JPS5653552Y2 (https=) 1976-06-08 1976-06-08

Country Status (1)

Country Link
JP (1) JPS5653552Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041603A (ja) * 2015-08-21 2017-02-23 ルネサスエレクトロニクス株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037366A (https=) * 1973-08-06 1975-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037366A (https=) * 1973-08-06 1975-04-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041603A (ja) * 2015-08-21 2017-02-23 ルネサスエレクトロニクス株式会社 半導体装置
US10553558B2 (en) 2015-08-21 2020-02-04 Renesas Electronics Corporation Semiconductor device

Also Published As

Publication number Publication date
JPS5653552Y2 (https=) 1981-12-14

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