JPS52163386U - - Google Patents

Info

Publication number
JPS52163386U
JPS52163386U JP7219576U JP7219576U JPS52163386U JP S52163386 U JPS52163386 U JP S52163386U JP 7219576 U JP7219576 U JP 7219576U JP 7219576 U JP7219576 U JP 7219576U JP S52163386 U JPS52163386 U JP S52163386U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7219576U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7219576U priority Critical patent/JPS52163386U/ja
Publication of JPS52163386U publication Critical patent/JPS52163386U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Radiation Pyrometers (AREA)
JP7219576U 1976-06-04 1976-06-04 Pending JPS52163386U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7219576U JPS52163386U (enrdf_load_stackoverflow) 1976-06-04 1976-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7219576U JPS52163386U (enrdf_load_stackoverflow) 1976-06-04 1976-06-04

Publications (1)

Publication Number Publication Date
JPS52163386U true JPS52163386U (enrdf_load_stackoverflow) 1977-12-10

Family

ID=28543287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7219576U Pending JPS52163386U (enrdf_load_stackoverflow) 1976-06-04 1976-06-04

Country Status (1)

Country Link
JP (1) JPS52163386U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130565A (ja) * 1981-11-04 1983-08-04 リツエンツイア・パテント−フエルヴアルツングス−ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 放射線受信機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130565A (ja) * 1981-11-04 1983-08-04 リツエンツイア・パテント−フエルヴアルツングス−ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 放射線受信機

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