JPS52152167A - Position adjusting mechanism of article positioning pawls - Google Patents

Position adjusting mechanism of article positioning pawls

Info

Publication number
JPS52152167A
JPS52152167A JP6880976A JP6880976A JPS52152167A JP S52152167 A JPS52152167 A JP S52152167A JP 6880976 A JP6880976 A JP 6880976A JP 6880976 A JP6880976 A JP 6880976A JP S52152167 A JPS52152167 A JP S52152167A
Authority
JP
Japan
Prior art keywords
adjusting mechanism
position adjusting
article positioning
positioning pawls
pawls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6880976A
Other languages
Japanese (ja)
Inventor
Haruo Amada
Masahiro Horii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6880976A priority Critical patent/JPS52152167A/en
Publication of JPS52152167A publication Critical patent/JPS52152167A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To perforj the mounting position adjustment of pawls simply and accurately by making possible axial inching of an operating shaft which mounts the positioning pawls for positioning of articles.
COPYRIGHT: (C)1977,JPO&Japio
JP6880976A 1976-06-14 1976-06-14 Position adjusting mechanism of article positioning pawls Pending JPS52152167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6880976A JPS52152167A (en) 1976-06-14 1976-06-14 Position adjusting mechanism of article positioning pawls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6880976A JPS52152167A (en) 1976-06-14 1976-06-14 Position adjusting mechanism of article positioning pawls

Publications (1)

Publication Number Publication Date
JPS52152167A true JPS52152167A (en) 1977-12-17

Family

ID=13384398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6880976A Pending JPS52152167A (en) 1976-06-14 1976-06-14 Position adjusting mechanism of article positioning pawls

Country Status (1)

Country Link
JP (1) JPS52152167A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559424A (en) * 1978-07-07 1980-01-23 Hitachi Ltd Leed frame positioning mechanism
JPS5572044A (en) * 1978-11-27 1980-05-30 Toshiba Corp Apparatus for positioning pellet holder
JP2008039322A (en) * 2006-08-08 2008-02-21 Univ Of Tokyo Heat exchanger and heat exchange apparatus having the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559424A (en) * 1978-07-07 1980-01-23 Hitachi Ltd Leed frame positioning mechanism
JPS5572044A (en) * 1978-11-27 1980-05-30 Toshiba Corp Apparatus for positioning pellet holder
JPS563667B2 (en) * 1978-11-27 1981-01-26
JP2008039322A (en) * 2006-08-08 2008-02-21 Univ Of Tokyo Heat exchanger and heat exchange apparatus having the same

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