JPS52132100A - Epoxy resin molding materials for sealing semiconductors - Google Patents

Epoxy resin molding materials for sealing semiconductors

Info

Publication number
JPS52132100A
JPS52132100A JP4879076A JP4879076A JPS52132100A JP S52132100 A JPS52132100 A JP S52132100A JP 4879076 A JP4879076 A JP 4879076A JP 4879076 A JP4879076 A JP 4879076A JP S52132100 A JPS52132100 A JP S52132100A
Authority
JP
Japan
Prior art keywords
molding materials
epoxy resin
resin molding
sealing semiconductors
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4879076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5546409B2 (enExample
Inventor
Goro Tanaka
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP4879076A priority Critical patent/JPS52132100A/ja
Publication of JPS52132100A publication Critical patent/JPS52132100A/ja
Publication of JPS5546409B2 publication Critical patent/JPS5546409B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4879076A 1976-04-28 1976-04-28 Epoxy resin molding materials for sealing semiconductors Granted JPS52132100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4879076A JPS52132100A (en) 1976-04-28 1976-04-28 Epoxy resin molding materials for sealing semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4879076A JPS52132100A (en) 1976-04-28 1976-04-28 Epoxy resin molding materials for sealing semiconductors

Publications (2)

Publication Number Publication Date
JPS52132100A true JPS52132100A (en) 1977-11-05
JPS5546409B2 JPS5546409B2 (enExample) 1980-11-22

Family

ID=12813021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4879076A Granted JPS52132100A (en) 1976-04-28 1976-04-28 Epoxy resin molding materials for sealing semiconductors

Country Status (1)

Country Link
JP (1) JPS52132100A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPH0841176A (ja) * 1995-06-26 1996-02-13 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPH0841176A (ja) * 1995-06-26 1996-02-13 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS5546409B2 (enExample) 1980-11-22

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