JPS52122666U - - Google Patents
Info
- Publication number
- JPS52122666U JPS52122666U JP1976030909U JP3090976U JPS52122666U JP S52122666 U JPS52122666 U JP S52122666U JP 1976030909 U JP1976030909 U JP 1976030909U JP 3090976 U JP3090976 U JP 3090976U JP S52122666 U JPS52122666 U JP S52122666U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976030909U JPS52122666U (es) | 1976-03-15 | 1976-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976030909U JPS52122666U (es) | 1976-03-15 | 1976-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52122666U true JPS52122666U (es) | 1977-09-17 |
Family
ID=28490421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976030909U Pending JPS52122666U (es) | 1976-03-15 | 1976-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52122666U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019087676A (ja) * | 2017-11-08 | 2019-06-06 | 株式会社豊田自動織機 | 半導体装置 |
-
1976
- 1976-03-15 JP JP1976030909U patent/JPS52122666U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019087676A (ja) * | 2017-11-08 | 2019-06-06 | 株式会社豊田自動織機 | 半導体装置 |