JPS52122666U - - Google Patents

Info

Publication number
JPS52122666U
JPS52122666U JP1976030909U JP3090976U JPS52122666U JP S52122666 U JPS52122666 U JP S52122666U JP 1976030909 U JP1976030909 U JP 1976030909U JP 3090976 U JP3090976 U JP 3090976U JP S52122666 U JPS52122666 U JP S52122666U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976030909U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976030909U priority Critical patent/JPS52122666U/ja
Publication of JPS52122666U publication Critical patent/JPS52122666U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1976030909U 1976-03-15 1976-03-15 Pending JPS52122666U (bg)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976030909U JPS52122666U (bg) 1976-03-15 1976-03-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976030909U JPS52122666U (bg) 1976-03-15 1976-03-15

Publications (1)

Publication Number Publication Date
JPS52122666U true JPS52122666U (bg) 1977-09-17

Family

ID=28490421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976030909U Pending JPS52122666U (bg) 1976-03-15 1976-03-15

Country Status (1)

Country Link
JP (1) JPS52122666U (bg)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087676A (ja) * 2017-11-08 2019-06-06 株式会社豊田自動織機 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087676A (ja) * 2017-11-08 2019-06-06 株式会社豊田自動織機 半導体装置

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